Enterprise E1.S PCIe SSD
N5200 E1.S
- Enterprise SSD U.2 (15mm) and E1.S (5.9mm/9.5mm/15mm enclosures available)
- Compliant to PCIe Gen 4x4 lanes, NVMe 1.4 interface
- User density 1.92TB, 3.84TB and 7.68TB
- Sequential data rates of up to 7,000 MB/s read and 4,200 MB/s write (sustained)
- Random data rates up to 1,350 kIOPS read and 450 kIOPS write (sustained)
- High endurance >1 DWPD, JEDEC enterprise workload over 5 years lifetime
- Multi-namespace support up to 128
- Powersafe: power fail protection
- Security and encryption: TCG OPAL 2.01 / AES256
The N5200 Gen4 PCIe E1.S SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.
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Series Name |
N5200 E1.S |
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Standard & Interface |
PCIe Gen 4.0 / NVMe 1.4, x4 lanes |
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Package |
E1.S |
| Connector |
SFF-TA-1006 E1.S |
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Outline Dimensions (L x W x H) |
111.25mm x 33.7mm x max. 5.5/9.5/15mm |
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Flash Type |
3D NAND eTLC |
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Density Range |
1.92 TB, 3.84 TB, 7.68 TB |
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Endurance [DWPD] |
> 1.0 for 5 years |
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Operating Temperature |
0°C to +70°C |
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Storage Temperature |
-40°C to +85°C |
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Performance |
Sequential data rates of up to 6,900 MB/s read and 4,200 MB/s write (sustained)
|
|
Voltage |
VCC: 12V (+/-10%) |
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Average Power |
14.5 W |
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DRAM |
DDR4 DRAM |
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MTBF |
> 2,500,000 hours |
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Data Reliability |
< 1 sector per 10^17 bits |
| Features & Tools |
OCP NVMe Cloud SSD Specification 1.0 support |
M.2 PCIe SSD
N-30 m2 (P) / N-36m2 (P)
- 2 form factor 2280 to 2242
- Powersafe optional
- PCIe Gen3 / NVMe 1.4 / four lanes
- Industrial 3D NAND TLC / pSLC
- Temperature range up to -40°C to 85°C
- High Performance
- AES256 Encryption / TCG Opal 2.0
- In-Field Firmware Update
N-32 m2 P
- 2 form factor 2280
- With Powersafe function
- PCIe Gen4 / NVMe 1.4 / four lanes
- 3D NAND eTLC
- Temperature range up to 0°C to 70°C
- High Endurance: 1DWPD / 5 years / enterprise workload
- Data Care Management
- AES256 Encryption / TCG Opal 2.0
- In-Field Firmware Update
N-20m2 / N-26m2
- M.2 form factor 2280 to 2230
- PCIe Gen3.1 / NVMe 1.3 four lanes
- Industrial 3D NAND TLC / pSLC
- Temperature range up to -40°C to 85°C
- DRAM-less / HMB (Host Memory Buffer)
- AES256 Encryption / TCG Opal
- In-Field Firmware Update
N-10m2 / N-16m2
- M.2 form factor 2280
- PCIe Gen3 / NVMe 1.2 two lanes
- DRAM supported FTL
- Industrial 3D NAND TLC / pSLC
- temperature range up to -40°C to 85°C
- Data Care Management
- AES256 Encryption
- In-Field Firmware Update
The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.
The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.
For industrial and embedded markets Swissbit addresses these different needs with the N-20m2 with HMB support, low power consumption and small form factors, and with the high performance N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N-32m2 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.
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Series Name |
N-20m2 / N-26m2 |
N-30m2 (P) / N-36m2 P |
|
Standard & Interface |
PCIe 3.1 / NVMe 1.3, x4 lanes |
PCIe 3.1 / NVMe 1.4, x4 lanes |
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Package |
PCIe M.2 (2280 to 2230) |
PCIe M.2 (2280, 2242) |
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Connector |
75 pos. Edge Connector M key |
75 pos. Edge Connector M key |
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Outline Dimensions |
80, 42, 30 x 22 x 3.5 mm | 80, 42 x 22 x 3.58 mm |
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Flash Type |
3D NAND TLC / 3D NAND pSLC |
|
|
Density Range |
TLC: 15 GB - 480 GB |
TLC: 240 GB – 3,840 GB pSLC: 80 GB – 320 GB |
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Data Retention |
10 years @ life begin |
|
|
Endurance [DWPD] |
max. 2.7 / 100 |
max. 3 / tbd |
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Operating Temperature |
Commercial: 0°C to +70°C |
Industrial: -40°C to +85°C |
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Storage Temperature |
-40°C to +85°C |
|
|
Performance Sequential Read (MB/s) |
up to 1,775 / 1,773 |
up to 3,500 / 3,500 up to 3,100 / 3,000 up to 490,000 / 380,000 up to 520,000 / 540,000 |
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Voltage |
VCC: 2.70 – 3.60 |
|
|
DRAM |
HMB support |
DRAM support |
| Features & Tools | Active and Passive Data Care Management AES 256 / E2E Data Path Protection FW Power Fail Data Loss Protection Active State Power Management (ASPM) Support TCG OPAL 2.0 Swissbit Life Time Monitoring (SBLTM) Tool and SDK for SBLTM (on request) |
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Features
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.
In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).