M.2 PCIE


The PCIe interface with NVMe protocol has become the new standard for consumer, enterprise and embedded applications. Although all three use the same SSD architecture, the individual requirements differ significantly. While high capacity and speed are most important for client and enterprise applications and are addressed by the market, the resulting heat generation poses a huge challenge to embedded applications.

The necessity to adopt the new interface standard while still just requiring small capacities ask for dedicates products. Immunity against data loss at power fail is a strong requirement for embedded and enterprise applications.

For industrial and embedded markets Swissbit addresses these different needs with the N-20m2 with HMB support, low power consumption and small form factors, and with the high performance N-30m2 with powersafe™ hardware power fail protection. They feature thermal and data care management and various security options. Both series are also available in pSLC variants with highly increased endurance. The N-32m2 powersafe™ is optimized for NetCom and enterprise applications that require enterprise grade endurance with a strong Swissbit typical value set.

Series Name

N-20m2 / N-26m2

N-30m2 (P) / N-36m2 P

Standard & Interface

PCIe 3.1 / NVMe 1.3, x4 lanes

PCIe 3.1 / NVMe 1.3, x4 lanes

Package

PCIe M.2 (2280 to 2230)

PCIe M.2 (2280, 2242)

Connector

75 pos. Edge Connector

M key

75 pos. Edge Connector

M key

Outline Dimensions

80, 42, 30 x 22 x 3.5 mm 80, 42 x 22 x 3.58 mm

Flash Type

3D NAND TLC / 3D NAND pSLC

Density Range

TLC: 15 GB - 480 GB
pSLC: 5 GB - 160 GB

TLC: 240 GB – 3,840 GB
pSLC: 80 GB – 320 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

max. 2.7 / 100

max. 3 / tbd

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)

 

up to 1,775 / 1,773
up to 750 / 827
up to 140,000 / 140,000
up to 112,000 / 131,000

 

up to 3,500 / 3,500
up to 3,100 / 3,000
up to 490,000 / 380,000
up to 520,000 / 540,000

Voltage

VCC: 2.70 – 3.60

DRAM

HMB support

DRAM support
HW powersafe™ on 2280 (P)

Features & Tools Active and Passive Data Care Management
AES 256 / E2E Data Path Protection
FW Power Fail Data Loss Protection
Active State Power Management (ASPM) Support
TCG OPAL 2.0
Swissbit Life Time Monitoring (SBLTM) Tool and SDK for SBLTM (on request)
Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).