Data Center 2.5‘‘ U.3 PCIe SSD


The D1200 PCIe/NVMe SSD represents a significant leap forward in high-performance flash storage solutions. The Data Center SSD offers high reliability, ultimate performance, and low power consumption for I/O-intensive data center applications such as databases, data storage, cloud computing, and artificial intelligence. With an extended feature set that increases sequential and random write performance, peak efficiency of data center operations is ensured.

Series Name

D1200

Standard & Interface

PCIe Gen 4.0 / NVMe 1.4, x4 lanes

Package

2.5”, U.3 backwards compatible to U.2

Connector

SFF-8639 U.3

Outline Dimensions (L x W x H)

100.45mm x 69.85mm x 14.8mm

Flash Type

3D NAND eTLC

Density Range

7.68 TB, 15.36 TB

Endurance [DWPD]
Enterprise Workload

> 1.5 for 5 years

Operating Temperature

0°C to +70°C

Storage Temperature

-40°C to +85°C

Performance Clusters

Optimized for highest system performance up to 900k IOPS and 7,000 MB/s

Voltage

VCC: 12V (-20%, +10%)

Average Power
Mixed Rd/Wr

16.3 W

DRAM

DDR4 DRAM

MTBF

> 2,000,000 hours

Data Reliability

< 1 sector per 10^17 bits

Features & Tools

Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T., Telemetry)
Persistent Event Log
AES 256 Data Encryption & Crypto Erase
Firmware Upgrade without Reset
Full Data Path Protection
Secure Boot
Secure Download
Flexible Power Management
Hot Pluggable
TRIM
Multi-namespace support up to 128
EUI64/NGUID
Timestamp
Weighted Round Robin (WRR)
powersafe power fail protection

Enterprise 2.5‘‘ U.2 PCIe SSD


The N5200 Gen4 PCIe U.2 SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

Series Name

N5200 U.2

Standard & Interface

PCIe Gen 4.0 / NVMe 1.4, x4 lanes

Package

2.5”

Connector

SFF-8639 U.2

Outline Dimensions (L x W x H)

100.2mm x 69.85mm x 15mm

Flash Type

3D NAND eTLC

Density Range

1.92 TB, 3.84 TB, 7.68 TB

Endurance [DWPD]
Enterprise Workload

1.5 for 5 years

Operating Temperature

0°C to +70°C

Storage Temperature

-40°C to +85°C

Performance

Sequential data rates of up to 7,100 MB/s read and 4,200 MB/s write (sustained)


Random data rates up to 1,150 KIOPS read and 950 KIOPS write (sustained)

Voltage

VCC: 12V (+/-10%)

Average Power
Mixed Rd/Wr

14.5 W

DRAM

DDR4 DRAM

MTBF

> 2,500,000 hours

Data Reliability

< 1 sector per 10^17 bits

Features & Tools

OCP NVMe Cloud SSD Specification 1.0 support
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T., Telemetry)
T10 DIF/DIX Vital Product Data (VPD) over SMBus Supported
Security and encryption: TCG OPAL 2.01 / AES256
Secure Boot
Crypto Erase
ECDSA-256 FW Image Authentication Supported
End to end path protection
NVMe Management Interface Basic Management Command
Multi-namespace support up to 128
Powersafe power fail protection

Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power Fail Protection
Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.