M.2 SATA


M.2 SSD モジュールは、非常に小さな設置面積で大容量ストレージを必要とする、超薄型の組込みコンピューティングアプリケーションに最適なフォームファクタです。Swissbit の SATA SSD モジュールは、制御された BOM と製品変更通知プロセスを組み合わせて、長期供給を実現します。
pSLC の X-66m2/MLC の X-60m2 および SLC 技術の X-600m2 は、DRAM 対応の FTL により SATA 6Gb/s の速度を提供します。これらは、シーケンシャルアクセスで最大 520 Mb/s、4 KB のランダムアクセスで 78,000 IOPS の高速データ転送速度を必要とするすべての産業用、情報通信、およびオートモティブ用途向けに設計されています。

産業用グレード 3D NAND を搭載した X-75m2 モジュールは、バックグラウンドデータのリフレッシュ、AES、エンドツーエンドのデータ保護をサポートすることで、要求の厳しい用途向けに設計されています。
さらに高寿命の要件では、3D pSLC モードの X-76m2 が最適なソリューションです。

新しい X-86m2 は、低消費電力と高い費用効果を実現するように設計されています。X-86m2 では 3D pSLC を搭載した省 DRAM 産業用コントローラをそれぞれ使用しています。

Series Name X-66m2 / X-60m2 X-600m2 X-76m2 / X-75m2 X-86m2
Interface
Data Transfer Mode
SATA III – 6 Gbit/s
ATA8
Connector 75 pos. Edge Connector
B & M key
Outline Dimensions 22 x 42 x 3.6 mm
Flash Type

pSLC everbit
MLC durabit

SLC 3D NAND pSLC / TLC 3D NAND pSLC
Density Range

X-66m2:
16 GB – 120 GB

X-60m2:
30 GB – 240 GB

8 GB – 64 GB

X-76m2:
10 GB - 160 GB

X-75m2:
30 GB - 480 GB

X-86m2:
10 GB - 160 GB

Data Retention 10 years @ life begin
1 year @ life end
Endurance [DWPD]
JESD219 Client Endurance Workload
13.2 / 2 30.5 max 21.7 / max 0.98 11.9
Operating Temperature Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature -40°C to +85°C
Performance
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
 
up to 520 / 520
up to 415 / 340
up to 80k / 72k
up to 73k / 78k
 
up to 520
up to 245
up to 76k
up to 54k
 
up to 560 / 565
up to 480 / 490
up to 72.9k / 73.2k
up to 84.9k / 79.4k

 
up to 373
up to 236
up to 13.1k
up to 8.5k

Voltage 3.3 V ± 5 %
Power Consumption
Read (Active)
Write (Active)
Idle
Slumber
 
1.3 W
1.6 W
360 mW
115 mW
 
1.5 W
1.7 W
345 mW
115 mW
 
2.2 W
2.9 W
395 mW
115 mW

 
1.5 W
0.9 W
230 mW
80 mW

Features & Tools Proven Power Fail Safety
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
DRAM supported FTL
E2E Data Protection
AES 256 Encryption /
TCG OPAL 2.0 (optional)
Advanced Wear Leveling, Bad Block Management
Proven Power Fail Safety
NCQ, TRIM
Data Refresh
In-field firmware update
SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring
E2E Data Protection
AES 256 Encryption /
TCG OPAL 2.0 (optional)
Advanced Wear Leveling, Bad Block Management
Proven Power Fail Safety
NCQ, TRIM
Data Refresh
In-field firmware update
SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

Series Name

X-66m2

X-60m2

X-600m2

X-76m2 / X-75m2 (P)

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

Connector

75 pos. Edge Connector

B & M key

Outline Dimensions

22 x 60 / 80 x 3.6 mm

22 x 80 x 3.6 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND pSLC / TLC

Density Range

16 GB – 240 GB

2260:
30 GB – 480 GB
2280:
30 GB - 960 GB

16 GB – 128 GB

X-76m2:
10 GB - 320 GB

X-75m2 (P):
30 GB - 1920 GB

Data Retention

10 years @ life begin

1 year @ life end

Endurance [DWPD]

JESD219 Client Endurance Workload

13.2 2.0 30.5

max 21.7 / max 1.20

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 520

up to 450

up to 75,000

up to 75,000

 

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 560 / 560

up to 480 / 500

up to 74,000 / 77,000

up to 84,900 / 71,200

Voltage

3.3 V ± 5 %

Power Consumption

Read (Active)
Write (Active)
Idle
Slumber

 

1.6 W
3.4 W
415 mW
115 mW

 

1.7 W
2.5 W
380 mW
115 mW

 

2.3 W
3.0 W
395 mW
115 mW

Features & Tools

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

 

X-75m2 P: Powersafe optional
E2E Data Protection
AES 256 Encryption (optional)
TCG OPAL 2.0 (optional)
Advanced Wear Leveling, Bad Block Management
Proven Power Fail Safety
NCQ, TRIM
Data Refresh
In-field firmware update
SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

mSATA MO-300


Swissbit の mSATA フルサイズ MO-300 SSD モジュールは、より小型で取り外し可能なフォームファクタでソリッドステートストレージを必要とする組込み用途に最適なソリューションです。各ユニットで、出荷前に全温度範囲で徹底的なテストが実施されています。
pSLC の X-66m/MLC の X-60m および SLC 技術の X-600m は、DRAM 対応の FTL により SATA 6Gb/s の速度を提供します。これらは、シーケンシャルアクセスで最大 520 Mb/s、4 KB のランダムアクセスで 78,000 IOPS の高速データ転送速度を必要とするすべての産業用、情報通信、およびオートモティブ用途向けに設計されています。

産業用グレード 3D NAND を搭載した新しい X-75m モジュールは、バックグラウンドデータのリフレッシュ、AES、エンドツーエンドのデータ保護をサポートすることで、要求の厳しい用途向けに設計されています。
さらに高寿命の要件では、3D pSLC モードの X-76m が最適なソリューションです。

Series Name

X-66m

X-60m

X-600m

X-76m / X-75m

X-200m

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

SATA II – 3 Gbit/s

up to PIO4, MDMA2, UDMA6

Connector

52 pos. Edge Connector

Outline Dimensions

50.8 x 29.85 x 3.3 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND pSLC / TLC

SLC

Density Range

4 GB – 240 GB

8 GB – 480 GB

4 GB – 128 GB

X-76m:
10 GB - 320 GB

X-75m:
30 GB - 960 GB

2 GB – 64 GB

Status

active

new

EOL planned

Data Retention

10 years @ life begin

1 year @ life end

Endurance [DWPD]

JESD219 Client Endurance Workload

13.2 2.0 30.5

max 21.7 / max 0.98

3.5

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 520

up to 450

up to 75,000

up to 75,000

 

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 565 / 565

up to 490 / 495

up to 77,400 / 73,600

up to 84,900 / 79,400

 

up to 120

up to 95

up to 3,100

up to 25

Voltage

3.3 V ± 5 %

Power Consumption

Read (Active)
Write (Active)
Idle
Slumber

 

1.5 W
3.2 W
380 mW
115 mW

 

1.7 W
2.5 W
380 mW
115 mW

 

2.4 W
3.0 W
395 mW
100 mW

 

1.3 W
1.7 W
660 mW

Features & Tools

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Protection
AES 256 Encryption (optional)
TCG OPAL 2.0 (optional)
Advanced Wear Leveling, Bad Block Management
Proven Power Fail Safety
NCQ, TRIM
Data Refresh
In-field firmware update
SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

Advanced Wear Leveling & Bad Block management

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Slim SATA MO-297


Swissbit の SATA MO-297 SSD モジュールは、より小型で取り外し可能なフォームファクターでソリッドステートストレージを必要とする組込み用途に最適なソリューションです。各ユニットで、出荷前に全温度範囲で徹底的なテストが実施されています。
X-60s/X-66s/X-600s シリーズ(pSLC/MLC/SLC)は、シーケンシャルアクセスで最大 525 MB/s、4 KB のランダムアクセスで 79,000 IOPS の高速データ転送速度を必要とするすべての産業用、情報通信、およびオートモティブ用途向けに設計されています。

産業用グレード 3D NAND を搭載した新しい X-75s モジュールは、バックグラウンドデータのリフレッシュ、AES、エンドツーエンドのデータ保護をサポートすることで、要求の厳しい用途向けに設計されています。
さらに高寿命の要件では、3D pSLC モードの X-76s が最適なソリューションです。

Series Name

X-66s

X-60s

X-600s

X-76s / X-75s

X-200s

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

 

SATA II – 3 Gbit/s

up to PIO4, MDMA2, UDMA6

Connector

15 + 7 pin Serial ATA Connector

Outline Dimensions

54 x 39 x 4 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND pSLC / TLC

SLC

Density Range

16 GB – 240 GB

30 GB – 480 GB

16 GB – 128 GB

X-76s:
10 GB - 320 GB

X-75s:
30 GB - 960 GB

2 GB – 64 GB

Status

active

new

EOL planned

Data Retention

10 years @ life begin

1 year @ life end

Endurance [DWPD]

JESD219 Client Endurance Workload

13.2 2.0 30.5

max 22.7 / max 0.98

3.5

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 520

up to 450

up to 75,000

up to 75,000

 

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 565 / 565

up to 490 / 495

up to 77,400 / 73,600

up to 84,900 / 79,400

 

up to 120

up to 95

up to 3,100

up to 25

Voltage

5 V ± 10 %

Power Consumption

Read (Active)
Write (Active)
Idle
Slumber

 

1.5 W
3.2 W
380 mW
115 mW

 

2.0 W
2.9 W
550 mW
275 mW

 

2.7 W
3.4 W
475 mW
125 mW

 

1.5 W
1.6 W
700 mW

Features & Tools

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Protection
AES 256 Encryption (optional)
TCG OPAL 2.0 (optional)
Advanced Wear Leveling, Bad Block Management
Proven Power Fail Safety
NCQ, TRIM
Data Refresh
In-field firmware update
SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

Advanced Wear Leveling & Bad Block management

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).