2.5インチ ドライブと同様に、スイスビット mSATA (MO-300)、SLIM SATA (MO-297)、および M.2 SSD は、小型で取り外し可能なフォーム ファクターのソリッド ステート ストレージを必要とする組み込みアプリケーションをターゲットとしています。SSD モジュールは、厳しい使用環境に耐えうる設計により堅牢性、耐衝撃性、耐振性、に優れ、また動作保証温度-40℃ ~ 85℃内での頻繁な温度変化に対しても安定したパフォーマンスを提供します。
X-86、X-75、X-76、X-60、X-66、および X-600 ファミリは、OS のブート、データ ログ、監視記録などのさまざまなユース ケースを想定して開発されました。 X-78m2 はさらに、ライトエンタープライズアプリケーションをターゲットとしています。 新しく追加された X-86m2 は、専用の産業用コントローラーとファームウェアに基づいた、堅牢で信頼性の高い低電力モジュール設計で産業アプリケーションをターゲットとしています。
Series Name | X-66m2 | X-600m2 | X-76m2 / X-78m2 | X-75m2 |
X-86m2 |
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
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Connector | 75 pos. Edge Connector B & M key |
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Outline Dimensions | 22 x 42 x 3.6 mm | ||||
Flash Type |
pSLC everbit |
SLC | 3D NAND pSLC | 3D NAND TLC | 3D NAND pSLC |
Density Range |
X-66m2: 16-120 GB |
8-64 GB |
X-76m2: 10-160 GB |
30-960 GB |
10-160 GB |
Data Retention | 10 years @ life begin 1 year @ life end |
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Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 | 36.3 | max 22.7 / max 60.5 | max 1.2 | max 13.3 |
Operating Temperature | Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
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Storage Temperature | -40°C to +85°C | ||||
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 up to 340 up to 72k up to 78k |
up to 520 up to 245 up to 76k up to 54k |
up to 560 / 560 up to 480 / 490 up to 72.9k / 72.9k up to 84.9k / 85.9k |
|
|
Voltage | 3.3 V ± 5 % | ||||
Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) / TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Series Name | X-60m2 / X-66m2 | X-600m2 | X-76m2 / X-78m2 |
X-75m2 / X-75m2 P |
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
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Connector | 75 pos. Edge Connector B & M key |
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Outline Dimensions | 22 x 80 x 3.58 mm 22 x 60 mm X-60m2 |
22 x 80 x 3.58 mm | ||
Flash Type |
MLC durabit |
SLC | 3D NAND pSLC | 3D NAND TLC |
Density Range |
X-60m2: 30-960 GB |
16-128 GB |
X-76m2: 10-320 GB |
X-75m2: 30-1,920GB |
Data Retention | 10 years @ life begin 1 year @ life end |
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Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 / 2.0 | 36.3 | max 22.7 / 60 | max 1.2 |
Operating Temperature | Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
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Storage Temperature | -40°C to +85°C | |||
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 / 520 up to 460 / 450 up to 75k / 80k up to 75k / 75k |
up to 520 up to 405 up to 76k up to 73k |
up to 560 / 560 up to 480 / 480 up to 72.9k / 70.4k up to 84.9k / 85.9k |
|
Voltage | 3.3 V ± 5 % | |||
Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) / TCG OPAL 2.0 (optional) FW based Power Fail Safety X-75m2 P: HW powersafe™ protection SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Swissbit の mSATA MO-300 SSD モジュールは、より小型で取り外し可能なフォームファクタでソリッドステートストレージを必要とする組込み用途に最適なソリューションです。出荷検査で全数・全温度範囲で徹底的なテストが実施されています。
pSLC の X-66m/MLC の X-60m および SLC 技術の X-600m は、DRAM 対応の FTL により SATA 6Gb/s の速度を提供します。これらは、シーケンシャルアクセスで最大 520 Mb/s、4 KB のランダムアクセスで 78,000 IOPS の高速データ転送速度を必要とするすべての産業用、情報通信、およびオートモティブ用途向けに設計されています。
産業用グレード 3D NAND を搭載した新しい X-75m モジュールは、バックグラウンドデータのリフレッシュ、AES、エンドツーエンドのデータ保護をサポートすることで、要求の厳しい用途向けに設計されています。
さらに高寿命の要件では、3D pSLC モードの X-76m が最適なソリューションです。
Series Name |
X-60m / X-66m |
X-600m |
X-75m / X-76m |
Interface |
SATA Gen3 – 6 Gbit/s |
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Connector |
52 pos. Edge Connector (PCI Express mini) |
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Outline Dimensions |
50.8 x 29.85 x 3.8 mm |
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Flash Type |
MLC durabit |
SLC |
3D NAND TLC / pSLC |
Density Range |
X-60m: 30–480 GB |
8-128 GB |
X-75m: 30-960 GB |
Data Retention |
10 years @ life begin |
||
Endurance [DWPD] |
2.0 / 13.2 | 33.8 |
max 1.2 / max 22.7 |
Operating Temperature |
Commercial: 0°C to +70°C |
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Storage Temperature |
-40°C to +85°C |
||
Performance Sequential Read (MB/s) |
up to 520 / 520 |
up to 520 |
up to 565 / 560 |
Voltage |
3.3 V ± 5 % |
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Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Swissbit の SATA MO-297 SSD モジュールは、より小型で取り外し可能なフォームファクターでソリッドステートストレージを必要とする組込み用途に最適なソリューションです。出荷検査で全数・全温度範囲で徹底的なテストが実施されています。X-60s/X-600s シリーズ(MLC/SLC)は、シーケンシャルアクセスで最大 525 MB/s、4 KB のランダムアクセスで 79,000 IOPS の高速データ転送速度を必要とするすべての産業用、情報通信、およびオートモティブ用途向けに設計されています。
産業用グレード 3D NAND を搭載した新しい X-75s モジュールは、バックグラウンドデータのリフレッシュ、AES、エンドツーエンドのデータ保護をサポートすることで、要求の厳しい用途向けに設計されています。更に書き換え寿命耐性を求める機器には、3D pSLC モードの X-76s が最適なソリューションです。
Series Name |
X-60s |
X-600s |
X-75s / X-76s |
X-78s |
Interface |
SATA Gen3 – 6 Gbit/s |
|||
Connector |
15 + 7 pin Serial ATA Connector |
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Outline Dimensions |
54 x 39 x 4.0 mm | |||
Flash Type |
MLC durabit |
SLC |
3D NAND TLC / pSLC |
3D NAND pSLC |
Density Range |
30–480 GB |
8-128 GB |
X-75s: 30-960 GB |
32-320 GB |
Data Retention |
10 years @ life begin |
|||
Endurance [DWPD] |
2.0 | 36.32 |
max 1.2 / max 22.7 |
max 48.8 |
Operating Temperature |
Commercial: 0°C to +70°C |
Industrial: -40°C to +85°C |
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Storage Temperature |
-40°C to +85°C |
|||
Performance Sequential Read (MB/s) |
up to 520 |
up to 520 |
up to 565 / 560 |
up to 560 |
Voltage |
3.3 V ± 5 % |
|||
Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.
In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.
This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).