M.2 SATA
X-86m2
- M.2-Formfaktor 2242
- Industrietaugliches 3D-NAND
- Konfiguriert in pSLC-Modus
- Preisoptimiert, niedrige Verlustleistung
- Datenpflegemanagement
- AES 256-Verschlüsselung / TCG Opal 2.0
- Erweiterter S.M.A.R.T.-Support
X-78m2 / X-76m2
- X-78m.2-Formfaktor in 2242
- X-76m.2-Formfaktor in 2242 und 2280
- Industrietaugliches 3D-NAND
- Powersafe optional
- Konfiguriert in pSLC-Modus
- Datenpflegemanagement
- Ausdauer bis zu 80 DWPD
- AES 256-Verschlüsselung / TCG Opal 2.0
- erweiterter S.M.A.R.T.-Support
X-75m2 (P)
- M.2-Formfaktor 2242 und 2280
- Industrietaugliches 3D TLC NAND
- Powersafe optional
- Datenpflegemanagement
- AES 256-Verschlüsselung / TCG Opal 2.0
- Erweiterter S.M.A.R.T.-Support
X-600m2 / X-66m2 / X-60m2 2280
- M.2-Formfaktor 2280
- X-600m2: SLC, X-66m2: pSLC, X-60m2: MLC
- Datenpflegemanagement
- X-60m2 durabit™, X-66m2 everbit™
- NCQ und TRIM-Support
- erweiterter S.M.A.R.T.-Support
X-600m2 / X-66m2 / X-60m2 2260
- M.2-Formfaktor 2260
- X-600m2: SLC, X-66m2: pSLC, X-60m2: MLC
- Datenpflegemanagement
- X-60m2 durabit™, X-66m2 everbit™
- NCQ und TRIM-Support
- erweiterter S.M.A.R.T.-Support
X-600m2 / X-66m2 / X-60m2 2242
- M.2-Formfaktor 2242
- X-600m2: SLC, X-66m2: pSLC, X-60m2: MLC
- Datenpflegemanagement
- X-60m2 durabit™, X-66m2 everbit™
- NCQ und TRIM-Support
- erweiterter S.M.A.R.T.-Support
Ebenso wie die 2,5-Zoll-Laufwerke zielen die Swissbit mSATA (MO-300), SLIM SATA (MO-297) und die M.2-SSDs auf eingebettete Anwendungen ab, die Solid-State-Speicher in kleinen, austauschbaren Formfaktoren erfordern. Die SSD-Module sind dafür ausgelegt Robustheit gegenüber häufigen Temperaturwechseln im Bereich von -40 °C bis 85 °C, halten starken Stößen und Vibrationen stand und bieten überlegene Leistung und Langlebigkeit.
Die Familien X-86, X-75, X-76, X-60, X-66 und X-600 zielen auf verschiedene Anwendungsfälle ab, darunter Betriebssystemstart, Datenprotokollierung, Überwachungsaufzeichnung oder Vaulting. Der X-78m2 zielt zusätzlich auf leichte Unternehmensanwendungen ab. Die Menge und Art der Schreibzugriffe definiert die erforderliche Ausdauer in TBW. Die neueste Ergänzung X-86m2 zielt auf echte Industrieanwendungen mit einem robusten, zuverlässigen Moduldesign mit geringem Stromverbrauch ab, das auf einem dedizierten Industriecontroller und Firmware basiert.
| Series Name | X-66m2 / X-60m2 | X-600m2 | X-76m2 / X-78m2 | X-75m2 | X-86m2 |
| Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
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| Connector | 75 pos. Edge Connector B & M key |
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| Outline Dimensions | 22 x 42 x 3.6 mm | ||||
| Flash Type |
pSLC everbit |
SLC | 3D NAND pSLC | 3D NAND TLC | 3D NAND pSLC |
| Density Range |
X-66m2: X-60m2: |
8 GB – 64 GB |
X-76m2: X-78m2: |
X-75m2: |
X-86m2: |
| Data Retention | 10 years @ life begin 1 year @ life end |
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| Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 / 2 | 30.5 | max 22.6 / max 60.5 | 0,98 | 11.9 |
| Operating Temperature | Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
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| Storage Temperature | -40°C to +85°C | ||||
| Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 / 520 up to 415 / 340 up to 80k / 72k up to 73k / 78k |
up to 520 up to 245 up to 76k up to 54k |
up to 560 / 560 up to 480 / 490 up to 72.9k / 72.9k up to 84.9k / 85.9k |
|
|
| Voltage | 3.3 V ± 5 % | ||||
| Power Consumption Read (Active) Write (Active) Idle Slumber |
1.3 W 1.6 W 360 mW 115 mW |
1.5 W 1.7 W 345 mW 115 mW |
2.4 W / 2.0 W 2.7 W / 2.3 W 415 mW / 380 mW 115 mW / 115 mW |
|
|
| Features & Tools | Proven Power Fail Safety NCQ, TRIM Advanced Wear Leveling & Bad Block management In-field firmware update SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
X-76m2: DRAM supported FTL E2E Data Protection AES 256 Encryption / TCG OPAL 2.0 (optional) Advanced Wear Leveling, Bad Block Management Proven Power Fail Safety NCQ, TRIM Data Refresh In-field firmware update SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
DRAM supported FTL |
E2E Data Protection AES 256 Encryption / TCG OPAL 2.0 (optional) Advanced Wear Leveling, Bad Block Management Proven Power Fail Safety NCQ, TRIM Data Refresh In-field firmware update SBLTM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
|
|
Series Name |
X-66m2 |
X-60m2 |
X-600m2 |
X-76m2 / X-75m2 (P) |
|
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
|||
|
Connector |
75 pos. Edge Connector B & M key |
|||
|
Outline Dimensions |
22 x 60 / 80 x 3.6 mm |
22 x 80 x 3.6 mm |
||
|
Flash Type |
pSLC everbit |
MLC durabit |
SLC |
3D NAND pSLC / TLC |
|
Density Range |
16 GB – 240 GB |
2260: |
16 GB – 128 GB |
X-76m2: X-75m2 (P): |
|
Data Retention |
10 years @ life begin 1 year @ life end |
|||
|
Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 | 2.0 | 30.5 |
max 21.7 / max 1.20 |
|
Operating Temperature |
Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
|||
|
Storage Temperature |
-40°C to +85°C |
|||
|
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 up to 450 up to 80,000 up to 75,000 |
up to 520 up to 450 up to 75,000 up to 75,000 |
up to 520 up to 405 up to 76,000 up to 73,000 |
up to 560 / 565 up to 480 / 500 up to 74,000 / 77,000 up to 84,900 / 79,400 |
|
Voltage |
3.3 V ± 5 % |
|||
|
Power Consumption Read (Active) |
1.6 W |
1.7 W |
2.3 W / 2.3 W |
|
|
Features & Tools |
Proven Power Fail Safety NCQ, TRIM Advanced Wear Leveling & Bad Block management In-field firmware update SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
|
X-75m2 P: Powersafe optional |
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mSATA MO-300
X-76m / X-75m
- Solid-State-Laufwerk (volle Größe) JEDEC MO-300
- industrietaugliches 3D-NAND
- X-76m: pSLC, X-75m: TLC
- Bis zu 84.000 IOPS
- Datenpflegemanagement
- Datensicherheit mit AES 256 / E2E
- erweiterter S.M.A.R.T.-Support
X-600m / X-66m / X-60m
- Solid-State-Laufwerk (volle Größe) JEDEC MO-300
- X-600m: SLC, X-66m: pSLC, X-60m: MLC
- Bis zu 75.000 IOPS
- Datenpflegemanagement
- X-60m durabit™, X-66m everbit™
- NCQ und TRIM-Support
- erweiterter S.M.A.R.T.-Support
Die mSATA-SSD-Module MO-300 (volle Größe) von Swissbit sind ideale Lösungen für eingebettete Anwendungen, die Solid-State-Speicher mit kleinem, auswechselbarem Formfaktor erfordern. Jedes Gerät wird im gesamten Temperaturbereich umfassend getestet, bevor es für den Versand freigegeben wird.
Das X-66m mit pSLC/X-60m mit MLC und das X-600m mit SLC unterstützen SATA-Schnittstellen mit 6 GBit/s Geschwindigkeit und DRAM-unterstütztem FTL. Sie sind für alle industriellen, NetCom- und Automobilanwendungen ausgelegt, die hohe Datenübertragungsraten von bis zu 520 MBit/s bei sequentiellem Zugriff und 78.000 IOPS beim Zugriff auf verteilte Daten (4 KB) erfordern.
Die neuen X-75m mSATA-Module mit industrietauglichem 3D-NAND wurden für anspruchsvolle Anwendungen entwickelt und unterstützen Datenaktualisierung im Hintergrund sowie AES- und End-to-End-Datensicherung.
Bei höheren Anforderungen in Bezug auf Endurance ist die X-76m mit 3D pSLC Mode die ideale Lösung.
|
Series Name |
X-66m |
X-60m |
X-600m |
X-76m / X-75m |
X-200m |
|
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
SATA II – 3 Gbit/s up to PIO4, MDMA2, UDMA6 |
|||
|
Connector |
52 pos. Edge Connector |
||||
|
Outline Dimensions |
50.8 x 29.85 x 3.3 mm |
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|
Flash Type |
pSLC everbit |
MLC durabit |
SLC |
3D NAND pSLC / TLC |
SLC |
|
Density Range |
4 GB – 240 GB |
8 GB – 480 GB |
4 GB – 128 GB |
X-76m: X-75m: |
2 GB – 64 GB |
|
Status |
active |
new |
EOL planned |
||
|
Data Retention |
10 years @ life begin 1 year @ life end |
||||
|
Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 | 2.0 | 30.5 |
max 21.7 / max 0.98 |
3.5 |
|
Operating Temperature |
Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
||||
|
Storage Temperature |
-40°C to +85°C |
||||
|
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 up to 450 up to 80,000 up to 75,000 |
up to 520 up to 450 up to 75,000 up to 75,000 |
up to 520 up to 405 up to 76,000 up to 73,000 |
up to 565 / 565 up to 490 / 495 up to 77,400 / 73,600 up to 84,900 / 79,400 |
up to 120 up to 95 up to 3,100 up to 25 |
|
Voltage |
3.3 V ± 5 % |
||||
|
Power Consumption Read (Active) |
1.5 W |
1.7 W |
2.4 W |
1.3 W |
|
|
Features & Tools |
Proven Power Fail Safety NCQ, TRIM Advanced Wear Leveling & Bad Block management In-field firmware update SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
E2E Data Protection |
Proven Power Fail Safety Advanced Wear Leveling & Bad Block management SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
||
SLIM SATA MO-297
X-76s / X-75s
- Solid-State-Laufwerk JEDEC MO-297
- Industrietaugliches 3D-NAND
- X-76s: pSLC, X-75s: TLC
- Bis zu 84.000 IOPS
- Datenpflegemanagement
- Datensicherheit mit AES 256 / E2E
- Erweiterter S.M.A.R.T.-Support
X-600s / X-66s / X-60s
- Solid-State-Laufwerk JEDEC MO-297
- X-600s: SLC, X-60s: MLC
- Bis zu 78.000 IOPS
- Datenpflegemanagement
- X-60s durabit™, X-66s everbit™
- NCQ und TRIM-Support
- erweiterter S.M.A.R.T.-Support
Die SATA-SSD-Module MO-297 von Swissbit sind ideale Lösungen für eingebettete Anwendungen, die Solid-State-Speicher mit kleinem, auswechselbarem Formfaktor erfordern. Jedes Gerät wird im gesamten Temperaturbereich umfassend getestet, bevor es für den Versand freigegeben wird. Die Produktreihe X-60s / X-600s (MLC / SLC) wurde für alle Industrie-, NetCom- und Automobilanwendungen ausgelegt, die hohe Datenübertragungsraten von bis zu 525 MBit/s bei sequentiellem Zugriff und 79.000 IOPS beim Zugriff auf verteilte Daten (4 KB) erfordern.
Die neuen X-75s-Module mit industrietauglichem 3D-NAND wurden für anspruchsvolle Anwendungen entwickelt und unterstützen Datenaktualisierung im Hintergrund sowie AES-256- und End-to-End-Datensicherung. Bei höheren Anforderungen in Bezug auf Endurance ist die X-76m mit 3D pSLC Mode die ideale Lösung.
|
Series Name |
X-66s |
X-60s |
X-600s |
X-76s / X-75s |
X-200s |
|
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8
|
SATA II – 3 Gbit/s up to PIO4, MDMA2, UDMA6 |
|||
|
Connector |
15 + 7 pin Serial ATA Connector |
||||
|
Outline Dimensions |
54 x 39 x 4 mm |
||||
|
Flash Type |
pSLC everbit |
MLC durabit |
SLC |
3D NAND pSLC / TLC |
SLC |
|
Density Range |
16 GB – 240 GB |
30 GB – 480 GB |
16 GB – 128 GB |
X-76s: X-75s: |
2 GB – 64 GB |
|
Status |
active |
new |
EOL planned |
||
|
Data Retention |
10 years @ life begin 1 year @ life end |
||||
|
Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 | 2.0 | 30.5 |
max 22.7 / max 0.98 |
3.5 |
|
Operating Temperature |
Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
||||
|
Storage Temperature |
-40°C to +85°C |
||||
|
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 up to 450 up to 80,000 up to 75,000 |
up to 520 up to 450 up to 75,000 up to 75,000 |
up to 520 up to 405 up to 76,000 up to 73,000 |
up to 565 / 565 up to 490 / 495 up to 77,400 / 73,600 up to 84,900 / 79,400 |
up to 120 up to 95 up to 3,100 up to 25 |
|
Voltage |
5 V ± 10 % |
||||
|
Power Consumption Read (Active) |
1.5 W |
2.0 W |
2.7 W |
1.5 W |
|
|
Features & Tools |
Proven Power Fail Safety NCQ, TRIM Advanced Wear Leveling & Bad Block management In-field firmware update SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
E2E Data Protection |
Proven Power Fail Safety Advanced Wear Leveling & Bad Block management SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
||
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).