The M.2 SSD modules are form factors ideally suited for ultrathin embedded computing applications, which require mass storage in a very small footprint. Our SATA SSD modules offer a long service life combined with controlled BOM and a product change notification process.
The X-66m2 with pSLC / X-60m2 with MLC and X-600m2 with SLC technology offer SATA 6Gb/s speed with DRAM supported FTL. They are designed for all industrial, netcom and automotive applications requiring high data transfer rates up to 520 MB/s in sequential access and 78,000 IOPS in 4KB random access.

The new X-75m2 modules with industrial grade 3D NAND are designed for demanding applications by supporting background data refresh, AES and end-to-end data protection

Series Name

X-66m2

X-60m2

X-600m2

X-75m2

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

Connector

75 pos. Edge Connector

B & M key

Outline Dimensions

22 x 42 x 3.6 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND

Density Range

16 GB – 120 GB

30 GB – 240 GB

8 GB – 64 GB

30 GB - 480 GB

Data Retention

10 years @ life begin

1 year @ life end

Endurance

max 13.2 TBW per GB drive capacity

(per JESD219 Client Workload)

max 2.0 TBW per GB drive capacity

(per JESD219 Client Workload)

max 31.9 TBW per GB drive capacity

(per JESD219 Client Workload)

3,000 P/E cycles

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 520

up to 415

up to 80,000

up to 73,000

 

up to 520

up to 340

up to 72,000

up to 78,000

 

up to 520

up to 245

up to 76,000

up to 54,000

 

up to 565

up to 490

up to 73,700

up to 79,000

Voltage

3.3 V ± 5 %

Power Consumption

typ 397 mA

max 550 mA

Idle 109 mA

DEVSLP <5 mA

typ 400 mA

max 495 mA

Idle 110 mA

DEVSLP <5 mA

typ 400 mA

max 515 mA

Idle 105 mA

DEVSLP <5 mA

typ 400 mA

max 650 mA

Idle 150 mA

Slumber 25 mA

Features & Tools

Pseudo SLC Flash with 20,000 Program/Erase Cycles

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Part Number

SFSAxxxxMvAAxss-t-dd-rrr-ccc

 

Series Name

X-66m2

X-60m2

X-600m2

X-75m2

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

Connector

75 pos. Edge Connector

B & M key

Outline Dimensions

22 x 60 / 80 x 3.6 mm

22 x 80 x 3.6 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND

Density Range

16 GB – 240 GB

30 GB – 960 GB

16 GB – 128 GB

30 GB - 960 GB

Data Retention

10 years @ life begin

1 year @ life end

Endurance

max 13.2 TBW per GB drive capacity

(per JESD219 Client Workload)

max 2.0 TBW per GB drive capacity

(per JESD219 Client Workload)

max 31.9 TBW per GB drive capacity

(per JESD219 Client Workload)

3,000 P/E cycles

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 520

up to 450

up to 72,000

up to 75,000

 

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 565

up to 495

up to 73,300

up to 79,000

Voltage

3.3 V ± 5 %

Power Consumption

typ 436 mA

max 610 mA

Idle 109 mA

DEVSLP <5 mA

typ 500 mA

max 960 mA

Idle 115 mA

DEVSLP <5 mA

typ 450 mA

max 750 mA

Idle 115 mA

DEVSLP <5 mA

typ 450 mA

max 700 mA

Idle 200 mA

Slumber 25 mA

Features & Tools

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Part Number

SFSAxxxxMvAAxss-t-dd-rrr-ccc

 

Product Features

mSATA MO-300

Do you have questions?

Swissbit’s mSATA full size MO-300 SSD modules are ideal solutions for embedded applications requiring Solid State storage in smaller, removable form factor. Each unit undergoes extensive testing at the full temperature range before being released for shipment.
The X-66m with pSLC / X-60m with MLC and X-600m with SLC technology support SATA 6Gb/s interface with DRAM supported FTL. They are designed for all industrial, netcom and automotive applications requiring high data transfer rates up to 520 MB/s in sequential access and 78,000 IOPS in 4KB random access.

The new X-75m modules with industrial grade 3D NAND are designed for demanding applications by supporting background data refresh, AES 256 and end-to-end data protection

Series Name

X-66m

X-60m

X-600m

X-75m

X-200m

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

SATA II – 3 Gbit/s

up to PIO4, MDMA2, UDMA6

Connector

52 pos. Edge Connector

PCI Express (PCIe) mini

Outline Dimensions

50.8 x 29.85 x 3.3 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND

SLC

Density Range

16 GB – 240 GB

8 GB – 480 GB

8 GB – 128 GB

30 GB - 960 GB

2 GB – 64 GB

Data Retention

10 years @ life begin

1 year @ life end

Endurance

max. 13 TBW per GB drive capacity

(per JESD219 Client Workload)

max 2.0 TBW per GB drive capacity

(per JESD219 Client Workload)

max 31.9 TBW per GB drivce capacity

(per JESD219 Client Workload)

3,000 P/E cycles
(Flash call level)

100,000 P/E cycles
(Flash cell level)

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Burst Rate (MB/s)

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS

Random 4KB Write (IOPS)

 

up to 600

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 600

up to 520

up to 450

up to 75,000

up to 75,000

 

up to 600

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 600

up to 520

up to 400

up to 73,000

up to 73,000

 

up to 300

up to 120

up to 95

up to 3,100

up to 25

Voltage

3.3 V ± 5 %

Power Consumption

typ 409 mA

max 610 mA

Idle 115 mA

DEVSLP 35 mA

typ 500 mA

max 960 mA

Idle 115 mA

DEVSLP 35 mA

typ 450 mA

max 750 mA

Idle 115 mA

DEVSLP 35 mA

max 700 mA

Idle 200 mA

Slumber 15 mA

typ 300 mA

max 490 mA

Idle 180 mA

Features & Tools

Pseudo SLC Flash with 20,000 Program/Erase Cycles

NCQ, TRIM

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

In-field firmware update

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

 

Proven Power Fail Safety

Advanced Wear Leveling & Bad Block management

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Part Number

SFSAxxxxUvAAxss-t-dd-rrr-ccc

 

SFSAxxxxUvBRxss-t-dd-rrr-ccc

 

Product Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).

SLIM SATA MO-297

Do you have questions?

Swissbit’s SATA MO-297 SSD modules are ideal solutions for embedded applications requiring Solid State storage in smaller, removable form factor. Each unit undergoes extensive testing at the full temperature range before being released for shipment.
The X-60s / X-66s / X-600s Series (pSLC / MLC / SLC) is designed for all industrial, NetCom and automotive applications requiring high data transfer rates up to 525 MB/s in sequential access and 79,000 IOPS in 4KB random access.

 

The new X-75s modules with industrial grade 3D NAND are designed for demanding applications by supporting background data refresh, AES 256 and end-to-end data protection

Series Name

X-66s

X-60s

X-600s

X-75s

X-200s

Interface

Data Transfer Mode

SATA III – 6 Gbit/s

ATA8

 

SATA II – 3 Gbit/s

up to PIO4, MDMA2, UDMA6

Connector

15 + 7 pin Serial ATA Connector

Outline Dimensions

54 x 39 x 4 mm

Flash Type

pSLC everbit

MLC durabit

SLC

3D NAND

SLC

Density Range

16 GB – 240 GB

30 GB – 480 GB

16 GB – 128 GB

30 GB - 960 GB

2 GB – 64 GB

Data Retention

10 years @ life begin

1 year @ life end

Endurance

max 13.20 TBW per GB drive capacity

(per JESD219 Client Workload)

max 2.0 TBW per GB drive
capacity

(per JESD219 Client Workload)

max 3.19 TBW per GB drive capacity

(per JESD219 Client Workload)

3000 P/E cycles

(Flash cell level)

100,000 P/E cycles

(Flash cell level)

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Burst Rate (MB/s)

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS

Random 4KB Write (IOPS)

 

up to 600

up to 520

up to 450

up to 80,000

up to 75,000

 

up to 600

up to 520

up to 450

up to 75,000

up to 75,000

 

up to 600

up to 520

up to 405

up to 76,000

up to 73,000

 

up to 600

up to 565

up to 495

up to 73,600

up to 79,400

 

up to 300

up to 120

up to 95

up to 3,100

up to 25

Voltage

5 V ± 10 %

Power Consumption

typ 400 mA

max 630 mA

Idle 110 mA

DEVSLP 55 mA

typ 450 mA

max 750 mA

Idle 110 mA

DEVSLP 55 mA

typ 300 mA

max 575 mA

Idle 110 mA

DEVSLP 55 mA

see datasheet

typ 260 mA

max 320 mA

Idle 140 mA

Features & Tools

Pseudo SLC Flash with 20,000 Program/Erase Cycles

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

AES256, E2E DATA Protection
NCQ, TRIM

Advanced Wear Leveling & Bad Block management

In-field firmware update

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitorin

Proven Power Fail Safety

Advanced Wear Leveling & Bad Block management

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

 

Part Number

SFSAxxxxVvAAxss-t-dd-rrr-ccc

SFSAxxxxVvAKxss-t-dd-rrr-ccc

SFSAxxxxVvBRxss-t-dd-rrr-ccc

 

Product Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).