Equally to the 2.5" drives, the Swissbit mSATA (MO-300), SLIM SATA (MO-297) and the M.2 SSDs target embedded applications which require solid state storage in small, removable form factors. The SSD modules are designed for robustness against frequent temperature changes within the -40˚C to 85˚C range, withstand high shock and vibration and offer superior performance and endurance.
The families X-86, X-75, X-76, X-60, X-66 and X-600 target different use cases including OS booting, data logging, surveillance recording or vaulting. The X-78m2 additionally targets light enterprise applications. The amount and type of write access defines the required endurance in TBW. The latest addition X-86m2 is targeting true industrial applications with a robust, reliable, low power module design, based on a dedicated industrial controller and firmware.
Series Name | X-66m2 | X-600m2 | X-76m2 / X-78m2 | X-75m2 |
X-86m2 |
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
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Connector | 75 pos. Edge Connector B & M key |
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Outline Dimensions | 22 x 42 x 3.6 mm | ||||
Flash Type |
pSLC everbit |
SLC | 3D NAND pSLC | 3D NAND TLC | 3D NAND pSLC |
Density Range |
X-66m2: 16-120 GB |
8-64 GB |
X-76m2: 10-160 GB |
30-960 GB |
10-160 GB |
Data Retention | 10 years @ life begin 1 year @ life end |
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Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 | 36.3 | max 22.7 / max 60.5 | max 1.2 | max 13.3 |
Operating Temperature | Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
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Storage Temperature | -40°C to +85°C | ||||
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 up to 340 up to 72k up to 78k |
up to 520 up to 245 up to 76k up to 54k |
up to 560 / 560 up to 480 / 490 up to 72.9k / 72.9k up to 84.9k / 85.9k |
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Voltage | 3.3 V ± 5 % | ||||
Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) / TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Series Name | X-60m2 / X-66m2 | X-600m2 | X-76m2 / X-78m2 |
X-75m2 / X-75m2 P |
Interface Data Transfer Mode |
SATA III – 6 Gbit/s ATA8 |
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Connector | 75 pos. Edge Connector B & M key |
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Outline Dimensions | 22 x 80 x 3.58 mm 22 x 60 mm X-60m2 |
22 x 80 x 3.58 mm | ||
Flash Type |
MLC durabit |
SLC | 3D NAND pSLC | 3D NAND TLC |
Density Range |
X-60m2: 30-960 GB |
16-128 GB |
X-76m2: 10-320 GB |
X-75m2: 30-1,920GB |
Data Retention | 10 years @ life begin 1 year @ life end |
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Endurance [DWPD] JESD219 Client Endurance Workload |
13.2 / 2.0 | 36.3 | max 22.7 / 60 | max 1.2 |
Operating Temperature | Commercial: 0°C to +70°C Industrial: -40°C to +85°C |
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Storage Temperature | -40°C to +85°C | |||
Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 520 / 520 up to 460 / 450 up to 75k / 80k up to 75k / 75k |
up to 520 up to 405 up to 76k up to 73k |
up to 560 / 560 up to 480 / 480 up to 72.9k / 70.4k up to 84.9k / 85.9k |
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Voltage | 3.3 V ± 5 % | |||
Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) / TCG OPAL 2.0 (optional) FW based Power Fail Safety X-75m2 P: HW powersafe™ protection SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Swissbit’s mSATA full size MO-300 SSD modules are ideal solutions for embedded applications requiring Solid State storage in smaller, removable form factor. Each unit undergoes extensive testing at the full temperature range before being released for shipment.
The X-66m with pSLC / X-60m with MLC and X-600m with SLC technology support SATA 6Gb/s interface with DRAM supported FTL. They are designed for all industrial, netcom and automotive applications requiring high data transfer rates up to 520 MB/s in sequential access and 78,000 IOPS in 4KB random access.
The new X-75m modules with industrial grade 3D NAND are designed for demanding applications by supporting background data refresh, AES and end-to-end data protection.
For higher endurance requirement the X-76m with 3D pSLC mode is the preferred solution.
Series Name |
X-60m / X-66m |
X-600m |
X-75m / X-76m |
Interface |
SATA Gen3 – 6 Gbit/s |
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Connector |
52 pos. Edge Connector (PCI Express mini) |
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Outline Dimensions |
50.8 x 29.85 x 3.8 mm |
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Flash Type |
MLC durabit |
SLC |
3D NAND TLC / pSLC |
Density Range |
X-60m: 30–480 GB |
8-128 GB |
X-75m: 30-960 GB |
Data Retention |
10 years @ life begin |
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Endurance [DWPD] |
2.0 / 13.2 | 33.8 |
max 1.2 / max 22.7 |
Operating Temperature |
Commercial: 0°C to +70°C |
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Storage Temperature |
-40°C to +85°C |
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Performance Sequential Read (MB/s) |
up to 520 / 520 |
up to 520 |
up to 565 / 560 |
Voltage |
3.3 V ± 5 % |
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Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Swissbit’s SATA MO-297 SSD modules are ideal solutions for embedded applications requiring Solid State storage in smaller, removable form factor. Each unit undergoes extensive testing at the full temperature range before being released for shipment. The X-60s / X-600s Series (MLC / SLC) is designed for all industrial, NetCom and automotive applications requiring high data transfer rates up to 525 MB/s in sequential access and 79,000 IOPS in 4KB random access.
The new X-75s modules with industrial grade 3D NAND are designed for demanding applications by supporting background data refresh, AES and end-to-end data protection. For higher endurance requirement the X-76s with 3D pSLC mode is the preferred solution.
Series Name |
X-60s |
X-600s |
X-75s / X-76s |
X-78s |
Interface |
SATA Gen3 – 6 Gbit/s |
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Connector |
15 + 7 pin Serial ATA Connector |
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Outline Dimensions |
54 x 39 x 4.0 mm | |||
Flash Type |
MLC durabit |
SLC |
3D NAND TLC / pSLC |
3D NAND pSLC |
Density Range |
30–480 GB |
8-128 GB |
X-75s: 30-960 GB |
32-320 GB |
Data Retention |
10 years @ life begin |
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Endurance [DWPD] |
2.0 | 36.32 |
max 1.2 / max 22.7 |
max 48.8 |
Operating Temperature |
Commercial: 0°C to +70°C |
Industrial: -40°C to +85°C |
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Storage Temperature |
-40°C to +85°C |
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Performance Sequential Read (MB/s) |
up to 520 |
up to 520 |
up to 565 / 560 |
up to 560 |
Voltage |
3.3 V ± 5 % |
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Features & Tools |
FW based Power Fail Safety |
E2E Data Path Protection AES 256 Encryption (optional) TCG OPAL 2.0 (optional) FW based Power Fail Safety SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring |
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.
In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.
This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).