PCIe 2.5データセンター向けSSD


新製品D1200シリーズ PCIe/NVMe SSDは、高性能フラッシュストレージソリューションにおける革命的なストレージデバイスです。データセンターSSDは、データベース、データストレージ、クラウドコンピューティング、人工知能などのI/O集中型データセンターアプリケーションに、高い信頼性、究極のパフォーマンス、低消費電力が求められD1200はこれらに対応します。シーケンシャルおよびランダムライトパフォーマンスを向上させる拡張機能セットにより、データセンターの運用において最高効率が保証されます。

Series Name

D1200

Standard & Interface

PCIe Gen 4.0 / NVMe 1.4, x4 lanes

Package

2.5”, U.3 backwards compatible to U.2

Connector

SFF-8639 U.3

Outline Dimensions (L x W x H)

100.45mm x 69.85mm x 14.8mm

Flash Type

3D NAND eTLC

Density Range

7.68 TB, 15.36 TB

Endurance [DWPD]
Enterprise Workload

> 1.5 for 5 years

Operating Temperature

0°C to +70°C

Storage Temperature

-40°C to +85°C

Performance Clusters

Optimized for highest system performance up to 900k IOPS and 7,000 MB/s

Voltage

VCC: 12V (-20%, +10%)

Average Power
Mixed Rd/Wr

16.3 W

DRAM

DDR4 DRAM

MTBF

> 2,000,000 hours

Data Reliability

< 1 sector per 10^17 bits

Features & Tools

Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T., Telemetry)
Persistent Event Log
AES 256 Data Encryption & Crypto Erase
Firmware Upgrade without Reset
Full Data Path Protection
Secure Boot
Secure Download
Flexible Power Management
Hot Pluggable
TRIM
Multi-namespace support up to 128
EUI64/NGUID
Timestamp
Weighted Round Robin (WRR)
powersafe power fail protection

Enterprise 2.5‘‘ U.2 PCIe SSD


The N5200 Gen4 PCIe U.2 SSD is optimized to serve the need for increasingly evolved storage for enterprise and edge data centers. The high performance SSD delivers a low KIOPS/watt performance while supporting excellent Quality of Service (QoS). Furthermore, the N5200 supports a wide range of features for modern enterprise data centers, including hardware-based security, advanced telemetry, data path and power failure protection. This make it an ideal choice for high-performance and mission-critical applications where reliability, durability, and scalability are essential.

The Gen 5 PCIe family D2200 is engineered for superior performance and reliability in data centers and enterprise environments. The D2200 sets a new standard for next generation connectivity, providing the best IOPS/watt performance, low latency and cutting-edge safety and security features. Backend by our commitment to exceptional customer service, we ensure seamless integration and direct support for your business needs. Experience the future of connectivity with the D2200 solution, tailored to meet the demands of high-performance applications and enabling your business to thrive in today’s rapidly evolving digital landscape.

Series Name

N5200 U.2

D2200 U.2

Standard & Interface

PCIe Gen 4.0 / NVMe 1.4, x4 lanes

PCIe Gen 5.0 / NVMe 2.0b, x4 lanes

Package

2.5”

Connector

SFF-8639 U.2

Outline Dimensions (L x W x H)

100.2mm x 69.85mm x 15mm

Flash Type

3D NAND eTLC

Density Range

1.92 TB, 3.84 TB, 7.68 TB

7.68 TB, 15.4 TB

Endurance [DWPD]
Enterprise Workload

1.5 for 5 years

1.0 for 5 years

Operating Temperature

0°C to +70°C

Storage Temperature

-40°C to +85°C

Sustained Performance

Sequential Read

Sequential Write

Random Read

Random Write

 

Up to 7,100 MB/s

Up to 4,200 MB/s

Up to 1,150 KIOPS

Up to 950 KIOPS

 

up to 14,000 MB/s

up to 10,000 MB/s

up to 2,600 KIOPS

up to 510 KIOPS

Voltage

VCC: 12V (+/-10%)

VCC: 12 V (-20%, +10%)

Average Power
Mixed Rd/Wr

14.5 W 19.5 W

DRAM

DDR4 DRAM

MTBF

> 2,500,000 hours

> 2,000,000 hours

Data Reliability

< 1 sector per 10^17 bits

Features & Tools

OCP NVMe Cloud SSD Specification 1.0 support
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T., Telemetry)
T10 DIF/DIX Vital Product Data (VPD) over SMBus Supported
Security and encryption: TCG OPAL 2.01 / AES256
Secure Boot
Crypto Erase
ECDSA-256 FW Image Authentication Supported
End to end path protection
NVMe Management Interface Basic Management Command
Multi-namespace support up to 128
Powersafe power fail protection

powersafeFunctionality
Full Data Path Protection
S.M.A.R.T
Flexible Power Management
Hot Pluggable
TRIM
Multi-namespace support up to 128
AES-XTS 256 Data Encryption & Crypto Erase
EUI64/NGUID
Support NVMe-MI 1.2b, support
MCTP over SMBus
Firmware Upgrade without Reset
Timestamp
Telemetry
Weighted Round Robin (WRR)
Persistent Event Log
Secure Download
Secure Boot

特徴とスペック

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.