CFexpress™ カード


CFexpress™ は、CompactFlash Association によって設定された、たコンパクト フラッシュおよび CFast の後継製品になります。ハイエンドの写真撮影用途などで開発されたストレージですが、スイスビットは現在、要求の厳しい産業用アプリケーションで使用するために、このストレージを自社の最新製品へ追加しました。 CFexpress 2.0 Type B ケーシングは、特に過酷な環境において優れており、外的ダメージからデータを守ります。完全な 金メッキ端子により、粉塵や湿気、いかなる振動にも耐性があります。G-20およびG2000シリーズは、低消費電力、拡張動作温度、高性能を提供します。

Series Name

G-20

G-26

G2000

G2600

Standard
Interface
Protocol

CFexpress v2.00
2 lanes PCIe 3.1
NVMe 1.3

Connector

CFexpress™ Type B Card

Outline Dimensions

38.5 × 29.8 × 3.8 mm

Flash Type

3D NAND TLC

3D NAND pSLC

3D NAND TLC

3D NAND pSLC

Density Range

15-480 GB

5-160 GB

60-960 GB

20-320 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

up to 1.8 up to 54 up to 2.2 up to 78

Operating Temperature

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)

 

up to 1,610
up to 830
up to 115,000
up to 131,000

 

up to 1,620
up to 700
up to 128,000
up to 121,000

 

up to 1,610
up to 842
up to 140,000
up to 145,000

 

up to 1,610
up to 924
up to 138,000
up to 143,000

MTBF

≥ 2,000,000 hours

Shock

500 g, 1 ms pulse duration, half-sine wave

Vibration

20 g, 10-2,000 Hz, 3 axes, 12 cycles/axis

Humidity

90% RH 85 °C, 96 hrs, max. supply voltage

Voltage

3.3V

Features & Tools

HMB Support
End to End Data Path Protection
AES 256 / TCG OPAL 2.0 (on request)
Firmware based Power Fail Data Loss Protection
Active State Power Management (ASPM) Support
Swissbit Device Manager (SBDM) Tool and SDK for SBDM (on request)

HMB Support
End to End Data Path Protection
AES 256 / TCG OPAL 2.0
Firmware based Power Fail Data Loss Protection
Active State Power Management (ASPM) Support
Swissbit Device Manager (SBDM) Tool and SDK for SBDM (on request)

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).