CFexpress™ カード

G-20 / G-26
- 小型リムーバブル PCIe カードフォームファクタ
- 3D NAND TLC/pSLC バージョン
- HMB サポートの PCIe 3.1 / NVMe 1.3 2 レーン
- エンドツーエンドデータパス保護
- 完全な電源断データ保護によるホットプラグサポート
- データケアマネジメントおよび S.M.A.R.T サポート
- AES 暗号化、TCG Opal 2.0 オプション対応
- 温度管理機能付きの完全な産業温度範囲
CFexpress™ は、CompactFlash Association によって設定された、たコンパクト フラッシュおよび CFast の後継製品になります。ハイエンドの写真撮影用途などで開発されたストレージですが、スイスビットは現在、要求の厳しい産業用アプリケーションで使用するために、このストレージを自社の最新製品へ追加しました。 CFexpress 2.0 Type B ケーシングは、特に過酷な環境において優れており、外的ダメージからデータを守ります。完全な 金メッキ端子により、粉塵や湿気、いかなる振動にも耐性があります。 G-20 シリーズは、低消費電力、拡張動作温度、ハイパフォーマンスを提供します。
Series Name |
G-20 |
G-26 |
Standard |
CFexpress v2.00 |
|
Connector |
CFexpress™ Type B Card |
|
Outline Dimensions |
38.5 × 29.8 × 3.8 mm |
|
Flash Type |
3D NAND TLC |
3D NAND pSLC |
Density Range |
15-960 GB |
5-320 GB |
Data Retention |
10 years @ life begin |
|
Endurance [DWPD] |
up to 1.8 | up to 54 |
Operating Temperature |
Industrial: -40°C to +85°C |
|
Storage Temperature |
-40°C to +85°C |
|
Performance Sequential Read (MB/s) |
up to 1,610 up to 830 up to 115,000 up to 130,000 |
|
MTBF |
≥ 2,000,000 hours |
|
Shock |
500 g, 1 ms pulse duration, half-sine wave |
|
Vibration |
20 g, 10-2,000 Hz, 3 axes, 12 cycles/axis |
|
Humidity |
90% RH 85 °C, 96 hrs, max. supply voltage |
|
Voltage |
3.3V |
|
Features & Tools |
HMB Support |
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.
In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.
This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).