CFexpress™ カード


CFexpress は、コンパクトフラッシュ協会が策定したコンパクトフラッシュと CFast の後継規格として期待されています。もともとハイエンドの写真撮影などのコンシューマ向けに開発されたこのストレージフォーマットを、Swissbit は要求の厳しい産業用アプリケーション向けの最新製品に適用しました。CFexpress 2.0 Type B ケーシングは、過酷な環境下での機械的保護に優れています。金メッキのピンは完全に覆われており、あらゆる接触からシールドされているため、埃や水分の侵入を防ぐとともに、あらゆる振動に耐えられます。G-20 シリーズは、M.2 や U.2 などの他の産業用 SSD フォームファクタ向けの定評ある技術である NVMe-1.3 インターフェースにより、シーケンシャルリード操作で最大 1620 MB/s、シーケンシャルライト操作では最大 840 MB/s を実現します。ランダムアクセスの場合、読取りおよび書込み操作の IOPS はそれぞれ 128000 および 131000 を超えます。コンパクトフラッシュカードの読取りデータレート 120 MB/s、CFast の 520 MB/s と比較すると、CFexpress は、技術的に大きく進歩しています。

Series Name

G-20

G-26

Interface

Protocol

PCIe Gen 3.1 x2

NVMe 1.3

Connector

CFExpress

Outline Dimensions

38.5 × 29.8 × 3.8 mm

Flash Type

3D NAND TLC

3D NAND pSLC

Density Range

15 - 480 GB

5 - 160 GB

Status

in Production

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

up to 1.6 up to 100

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Storage Temperature

-40°C to +100°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 1,600

up to 830

up to 128,000

up to 131,000

MTBF

≥ 2,000,000 hours

Shock

500 g, 1 ms pulse duration, half-sine wave

Vibration

20 g, 10-2,000 Hz, 3 axes, 12 cycles/axis

Humidity

90% RH 85 °C, 96 hrs, max. supply voltage

Voltage

3.3V

Features & Tools

HMB (host memory buffer) support
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
E2E Data path protection
SBLTM Tool for S.M.A.R.T. based Life Time Monitoring
AES 256 Encryption, TCG Opal (optional)

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).