CFexpress™ Karten

CFexpress ist der Nachfolge-Formfaktor der etablierten Compact-Flash- und CFast-Standards, gepflegt von der CompactFlash Association. Ursprünglich für die High-End-Fotografie und andere Consumer-Anwendungen entwickelt, wird das Speicherformat jetzt durch Swissbit für anspruchsvolle industrielle Anwendungen nutzbar gemacht. Das CFexpress-2.0-Gehäuse Typ B bietet einen ausgezeichneten mechanischen Schutz vor Umwelteinflüssen. Da die vergoldeten Pins vollständig abgedeckt und damit vor Berührung geschützt sind, ist die Karte unempfindlich gegen das Eindringen von Staub oder Feuchtigkeit und zugleich vibrationsfest. Dank der NVMe-1.3-Schnittstelle, die sich bei anderen industriellen SSD-Formfaktoren wie M.2 oder U.2 bewährt hat, erreicht die G-20-Serie bis zu 1 620 MB/s für sequenzielles Lesen und 840 MB/s für sequenzielles Schreiben. Bei Random-Zugriffen liegt sie über 128 000 beziehungsweise 131 000 IOPS für Lese- und Schreibvorgänge. Verglichen mit einer Lesedatenrate von 120 MB/s bei Compact-Flash-Karten und 520 MB/s bei CFast stellt CFexpress einen bedeutenden Entwicklungssprung dar.

Series Name





PCIe Gen 3.1 x2

NVMe 1.3



Outline Dimensions

38.5 × 29.8 × 3.8 mm

Flash Type



Density Range

15 - 480 GB

5 - 160 GB


in development

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

JESD219 Client Endurance Workload

up to 1.2 up to 20

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Storage Temperature

-40°C to +100°C


Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)


up to 1,600

up to 680

up to 140,000

up to 100,000


≥ 2,000,000 hours









Power Consumption

Read (Active)
Write (Active)



Features & Tools

HMB (host memory buffer) support
Advanced Wear Leveling & Bad Block management
E2E Data path protection
SBLTM Tool for S.M.A.R.T. based Life Time Monitoring
AES 256 Encryption, TCG Opal (optional)

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.


The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).