CFexpress™ 卡

CFexpress 被誉为由 CompactFlash 协会制定的 Compact Flash 和 CFast 标准的继任产品。Swissbit 最初开发用于高端摄影和其他消费类应用,现在已将其存储格式用于要求苛刻的工业应用中所适用的最新产品。CFexpress 2.0 B 型外壳在恶劣环境中提供极佳的机械保护。镀金针完全覆盖且防止任何形式的接触,因此可防尘、防潮,且同时确保卡耐任何振动。得益于采用 NVMe-1.3 接口这种适用于 M.2 或 U.2 等其他工业固态硬盘外形规格的久经验证的技术,G-20 系列可实现高达 1620MB/s 的顺序读取操作速度和 840MB/s 的顺序写入操作速度。对于随机访问,读取和写入操作分别超过 128000 和 131000 IOPS。与 Compact Flash 卡 120MB/s 和 CFast 520MB/s 的读取数据率相比,CFexpress 是一项重大的技术进步。

Series Name





PCIe Gen 3.1 x2

NVMe 1.3



Outline Dimensions

38.5 × 29.8 × 3.8 mm

Flash Type



Density Range

15 - 480 GB

5 - 160 GB


in Production

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

up to 1.6 up to 100

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Storage Temperature

-40°C to +100°C


Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)


up to 1,600

up to 830

up to 128,000

up to 131,000


≥ 2,000,000 hours


500 g, 1 ms pulse duration, half-sine wave


20 g, 10-2,000 Hz, 3 axes, 12 cycles/axis


90% RH 85 °C, 96 hrs, max. supply voltage



Features & Tools

HMB (host memory buffer) support
Advanced Wear Leveling & Bad Block management
E2E Data path protection
SBLTM Tool for S.M.A.R.T. based Life Time Monitoring
AES 256 Encryption, TCG Opal (optional)

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Read-only optimized
Read-only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases, the firmware can be optimized in order to guarantee the highest possible data retention and less read disturb.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).