CFast Cards™

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CFast™ cards combine the CompactFlash™ (CF) card form factor and the Serial ATA (SATA) interface into a single product. CFast™ cards can replace both HDDs and CompactFlash™ cards in applications requiring small form factors, high endurance and the ability to withstand shock, vibration, extreme temperatures (-40°C to +85°C), and rough environmental conditions. Swissbit’s CFast™ cards provide rugged and easy replaceable storage for embedded and industrial systems. The Swissbit CFast™ card portfolio covers the range from high-end SLC-based high-performance F-600 to the cost/performance optimized 3D NAND TLC F-80. A broad portfolio of CFast cards for different application requirements exist, all equipped with a rich  feature set and are fulfilling the high Swissbit quality requirements.

Series Name

F-800 F-86 / F-80 F-600 F-66 / F-60 F-56 / F-50 F-240

Interface

Data Transfer Mode

CFast™ 2.0 – SATA II – 3 Gbit/s
ATA8
CFast™ 2.0 – SATA III – 6 Gbit/s
ATA8
CFast™ 1.0 –SATA II – 3 Gbit/s
ATA7

Connector

CFast™ Type I

Outline Dimensions

36.4 x 42.8 x 3.6 mm

Flash Type

SLC 3D TLC / 3D pSLC SLC pSLC / MLC pSLC / MLC SLC

Density Range

2 GB-64 GB 10 GB - 160 GB /
30 GB - 480 GB
8 GB – 64 GB 4 GB – 120 GB /
8 GB - 240 GB
4 GB – 128 GB /
8 GB – 256 GB
2 GB – 64 GB

Status

Ramping Active EOL planned

Data Retention

 

10 years @ life begin
1 year @ life end

Endurance [DWPD]

JESD219 Client Endurance Workload

    33.8 13.2 / 1.98 7.98 / 1.50 max 2.63

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Storage Temperature

-40°C to +100°C

Performance
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)


up to 280
up to 150
up to 10.5k
up to 7.3k

up to tbd / 360
up to tbd / 220
up to tbd / 15k
up to tbd / 9k
 
up to 520
up to 245
up to 76k
up to 54k
 
up to 520 / 520
up to 415 / 180
up to 80k / 72k
up to 75k / 43k
 
up to 510 / 500
up to 415 / 330
up to 32k / 53,5k
up to 66k / 74k
 
up to 120
up to 120
up to 3.2k
up to 75

MTBF

≥ 2,000,000 hours ≥ 2,500,000 hours

Shock

500 G, 1 ms duration, half-sine wave 1,500 G, 0.5 ms duration, half-sine wave 500 G, 1 ms duration, half-sine wave 500 G, 1 ms duration, half-sine wave

Vibration

20 G, 80-2,000 Hz 50 G, 80-2,000 Hz 20 G, 80-2,000 Hz 20 G

Humidity

85 % RH 85°C, 1,000 hrs

Voltage

3.3 V ± 5 %

Power Consumption

Read (Active)
Write (Active)
Idle
Slumber


1.2W
0.9W
200 mW
8 mW

   
1.6 W
2.4 W
347 mW
115 mW
 
1.4 W
1.8 W
380 mW
116 mW
 
1.2 W
2.1 W
248 mW
17 mW
 
Max 3.2 W

380 mW
PHYSLP < 80 mA

Features & Tools

NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
F-6x: AES 256 Encryption (optional)

Proven Power Fail Safety
DRAM supported FTL
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
F-6x: AES 256 Encryption (optional)

Proven Power Fail Safety
Sophisticated Wear Leveling &
Bad Block management
Read Disturb Management
TRIM
Low Power Consumption
Security & SBZoneProtection
features available
SBLTM Tool & SDK for S.M.A.R.T.
based Life Time Monitoring

 

           

 

Product Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).