Swissbit at Embedded World 2026

Bronschhofen, Switzerland, February 10, 2026 – In its 25th anniversary year, Swissbit is setting the course for the continued expansion of its PCIe portfolio. At Embedded World 2026 in Nuremberg, Germany (March 10–12, Hall 1, Booth 1‑510), the company will provide an outlook on two new core PCIe SSD series – both built on Swissbit’s highly integrated manufacturing approach, including in‑house NAND packaging at its own Berlin fab. As the first major industry event of the year, embedded world offers Swissbit the platform to highlight the growing relevance of PCIe technologies for embedded, edge, and enterprise systems. Swissbit will also announce its cooperation with the Open Compute Project (OCP), initiating a broader roadmap toward future OCP Inspired™ products and reinforcing the company’s commitment to demanding server-storage applications.

As part of its ongoing portfolio development, Swissbit will use Embedded World 2026 to introduce two new PCIe SSD series that mark an important step in the company’s roadmap.

The new N7000 Series is a 4-channel PCIe SSD platform engineered to balance reliability, cost, and performance for next-generation boot drives. It integrates Power Loss Notification (PLN) to help protect data integrity during unexpected power interruptions and is optimized for robust system boot and lightweight workloads. The N7000 Series will be offered in M.2 2280 and M.2 2242 form factors, covering a density range from 80GB up to 4TB.

For performance-driven use cases, Swissbit will also preview the A2000 Series, an 8-channel PCIe Gen4/NVMe platform designed for high performance and low latency in demanding industrial and edge workloads, such as enterprise storage/server environments, high-end industrial applications, NetCom, and Edge AI. The A2000 Series will be available in M.2, E1.S, and U.2 form factors, with capacities ranging from 480GB up to 8TB.

In‑house NAND packaging as a strategic differentiator

Both the N7000 and A2000 Series are produced with 100% in‑house NAND packaging at Swissbit’s Berlin facility – a unique capability in Europe. Unlike the typical industry model that relies on external OSAT partners, Swissbit covers key back‑end assembly and test steps internally. This enables greater independence from flash vendors, tighter control over materials and the bill of materials, faster lead times, and increased supply‑chain resilience, while supporting long product lifecycles through wafer banking.

Both product families are scheduled to reach the market in the first half of 2026, with multiple versions rolling out step by step across the respective series.

More industrial storage highlights for long-term designs

Alongside the PCIe preview, Swissbit will present further highlights across its portfolio of reliable industrial-grade memory solutions with a strong emphasis on long-term availability. This includes solder-down options such as e.MMC and PCIe BGA products for embedded designs, as well as updates on the company’s next-generation SATA platform.