CompactFlash™ Karten


Bis heute sind CompactFlash™-Karten (CF) immer noch sehr beliebte Flash-Speicher für eingebettete und industrielle Anwendungen. Formfaktor und Anschluss der CompactFlash™-Karten sind weit verbreitet. Bei der Entwicklung der CF-Karten von Swissbit standen Qualität, Zuverlässigkeit, Widerstandsfähigkeit und Langlebigkeit im Mittelpunkt. Wir verwenden nur hochwertige Komponenten, und die Konstruktion erfolgt im Einklang mit den strengen Anforderungen unserer Kunden. Hardware und Firmware wurden von unserem erfahrenen technischen Team getestet und qualifiziert, und die Funktionen und Merkmale wurden in vielen anspruchsvollen Kundenanwendungen nachgewiesen.

Die Modelle C-350, C-4×0 und C-5×0 aus der Produktreihe CF von Swissbit werden sowohl mit kommerziellem (0 °C bis 70 °C) als auch mit industriellem (-40 °C bis 85 °C) Betriebstemperaturbereich angeboten. Es handelt sich um robuste und zuverlässige Speichermedien für eine Vielzahl von anspruchsvollen Anwendungsfällen. Bei der Entwicklung wurde eine Vielzahl von Aspekten berücksichtigt, von der Kompatibilität über den Boot-Vorgang und die Stromausfallsicherheit bis hin zu langfristigem Support, einer kontrollierten Stückliste und einer herausragenden Flash-Protokollabwicklung, die größtmögliche Datenintegrität gewährleistet. Swissbit legt weniger Wert auf die (häufig von anderen Anbietern beworbenen) Leistungskennzahlen für sequentielle Lese-/Schreibvorgänge, sondern vielmehr auf eine hohe Geschwindigkeit beim Lesen/Schreiben verteilter Daten. Dies ist bei älteren eingebetteten CompactFlash-Anwendungen eine der wichtigsten Anforderungen.

Die CF-Karte C-350 gewährleistet optimierte Abwärtskompatibilität mit älteren Systemen, eine geplante Verfügbarkeit von mehr als 7 Jahren, Speicherkapazitäten von 32 MB bis 256 MB und äußerst zuverlässigen SLC-Flash mit 100.000 Programmier-/Löschzyklen.

Die neuesten Produktfamilien mit CF-Karten von Swissbit sind C-500, C-50 und C-56. Durch seitenbasiertes Flash-Management erzielen sie Höchstwerte für Schreib-IOPS und haben eine hervorragende Lebensdauer.

Series Name

C-350

C-300L

C-440

C-500

C-56

C-50

Interface

CFA4.1

CFA5.0

CFA5.0 / CFA6.1 compatible

Interface
Data Transfer Mode

True IDE / PC card – Up to UDMA4, MDMA4 & PIO6

True IDE / PC card – Up to
UDMA6, MDMA4 & PIO6

Connector

CFC Type I

Outline Dimensions

36.4 x 42.8 x 3.3 mm

Flash Type

SLC

pSLC

MLC

Density Range

128 MB to 256 MB

128 MB to 1 GB

2 to 64 GB

512 MB to 64 GB

4 to 64 GB

8 to 128 GB

Status

Replacement for C-300/
C-300L
active

active

for new designs

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

JESD219 Enterprise Endurance Workload

max 0.76

 

max 0.92

max 3.50

max 1.11

max 0.14

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 19.8
up to 11.4
up to 2,900
up to 20

 

up to 22
up to 9
up to 3,700
up to 54

 

up to 65
up to 35
up to 2,400
up to 300 (w. Trim)

 

up to 64
up to 44
up to 3,200
up to 1,900

 

up to 115
up to 66
up to 5,000
up to 3,300

 

up to 114
up to 39
up to 3,500
up to 2,400

MTBF

≥ 3,000,000 hours

Shock

1,500 G

Vibration

20 G

Humidity

85 % RH 85°C, 1,000 hrs

Voltage

3.3 V ± 5 %
5 V ± 10 %

Power Consumption

PIO typ 50 mA @ 3.3 V
DMA typ 70 mA @ 3.3 V
DMA typ 110 mA @ 5 V

PIO typ 60 mA @ 3.3 V

DMA typ 80 mA @ 3.3 V
DMA typ 90 mA @ 5 V

max 120 mA
Idle 4.5 mA

max 130 mA
Idle 4.5 mA

Features & Tools

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad Block management

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

TRIM

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Page based FTL for maximum Endurance
Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Series Name

C-350

C-300L

C-440

C-500

C-56

C-50

Interface

CFA4.1

CFA5.0

CFA5.0 / CFA6.1 compatible

Interface
Data Transfer Mode

True IDE / PC card – Up to UDMA4, MDMA4 & PIO6

True IDE / PC card – Up to
UDMA6, MDMA4 & PIO6

Connector

CFC Type I

Outline Dimensions

36.4 x 42.8 x 3.3 mm

Flash Type

SLC

pSLC

MLC

Density Range

128 MB to 256 MB

128 MB to 1 GB

2 to 64 GB

512 MB to 64 GB

4 to 64 GB

8 to 128 GB

Status

Replacement for C-300/
C-300L
active

active

for new designs

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

JESD219 Enterprise Endurance Workload

max 0.76

 

max 0.92

max 3.50

max 1.11

max 0.14

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 19.8
up to 11.4
up to 2,900
up to 20

 

up to 22
up to 9
up to 3,700
up to 54

 

up to 65
up to 35
up to 2,400
up to 300 (w. Trim)

 

up to 64
up to 44
up to 3,200
up to 1,900

 

up to 115
up to 66
up to 5,000
up to 3,300

 

up to 114
up to 39
up to 3,500
up to 2,400

MTBF

≥ 3,000,000 hours

Shock

1,500 G

Vibration

20 G

Humidity

85 % RH 85°C, 1,000 hrs

Voltage

3.3 V ± 5 %
5 V ± 10 %

Power Consumption

PIO typ 50 mA @ 3.3 V
DMA typ 70 mA @ 3.3 V
DMA typ 110 mA @ 5 V

PIO typ 60 mA @ 3.3 V

DMA typ 80 mA @ 3.3 V
DMA typ 90 mA @ 5 V

max 120 mA
Idle 4.5 mA

max 130 mA
Idle 4.5 mA

Features & Tools

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad Block management

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

TRIM

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Page based FTL for maximum Endurance
Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Series Name

C-350

C-300L

C-440

C-500

C-56

C-50

Interface

CFA4.1

CFA5.0

CFA5.0 / CFA6.1 compatible

Interface
Data Transfer Mode

True IDE / PC card – Up to UDMA4, MDMA4 & PIO6

True IDE / PC card – Up to
UDMA6, MDMA4 & PIO6

Connector

CFC Type I

Outline Dimensions

36.4 x 42.8 x 3.3 mm

Flash Type

SLC

pSLC

MLC

Density Range

128 MB to 256 MB

128 MB to 1 GB

2 to 64 GB

512 MB to 64 GB

4 to 64 GB

8 to 128 GB

Status

Replacement for C-300/
C-300L
active

active

for new designs

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]

JESD219 Enterprise Endurance Workload

max 0.76

 

max 0.92

max 3.50

max 1.11

max 0.14

Operating Temperature

Commercial: 0°C to +70°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 19.8
up to 11.4
up to 2,900
up to 20

 

up to 22
up to 9
up to 3,700
up to 54

 

up to 65
up to 35
up to 2,400
up to 300 (w. Trim)

 

up to 64
up to 44
up to 3,200
up to 1,900

 

up to 115
up to 66
up to 5,000
up to 3,300

 

up to 114
up to 39
up to 3,500
up to 2,400

MTBF

≥ 3,000,000 hours

Shock

1,500 G

Vibration

20 G

Humidity

85 % RH 85°C, 1,000 hrs

Voltage

3.3 V ± 5 %
5 V ± 10 %

Power Consumption

PIO typ 50 mA @ 3.3 V
DMA typ 70 mA @ 3.3 V
DMA typ 110 mA @ 5 V

PIO typ 60 mA @ 3.3 V

DMA typ 80 mA @ 3.3 V
DMA typ 90 mA @ 5 V

max 120 mA
Idle 4.5 mA

max 130 mA
Idle 4.5 mA

Features & Tools

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad Block management

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

TRIM

Security & SBZoneProtection features available

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Page based FTL for maximum Endurance
Proven Power Fail Safety

Sophisticated Wear Leveling & Bad

Bad Block Management

Read Disturb Management

SBLTM Tool & SDK for S.M.A.R.T.

based Life Time Monitoring

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).