时至今日,CompactFlash™ (CF) 卡仍是用于嵌入式和工业市场中非常受欢迎的基于闪存的存储解决方案,且 CompactFlash™ 卡外形规格和连接器均很成熟。Swissbit 的 CF 卡的开发重点在于质量、可靠性、稳健性和使用寿命。我们只选择高质量组件,且采用满足客户严苛要求的设计规则。硬件和固件经我们经验丰富的技术团队的测试和验证,经证明,各种功能可适用于很多具有挑战性的客户应用。
Swissbit 的 CF 系列 C-350 和 C-5×0 提供商用(0°C 至 70°C)和工业用(-40°C 至 85°C)温度范围,为各种要求严苛的用例提供坚固和可靠的内存。它们旨在解决从兼容性、启动和断电安全性到长期供应、受控 BOM 和未解决的闪存协议处理技术的各种问题,以确保实现最高可能数据完整性。与普遍推广的顺序性能价值相比,Swissbit 特别关注优化的随机访问速度,这是传统嵌入式 CompactFlash 应用程序中的重要要求之一。
C-350 CF 卡确保与传统系统经优化的向后兼容性。该系列使用高度可靠的 SLC 闪存(具有 100’000 程序/擦除周期)提供从 32 MB 到 256 MB 的低密度。
Swissbit 的最新 CF 卡产品系列 C-500、C-50 和 C-56 使用基于页面的闪存管理,因此提供最高的写入 IOPS 速率和出色的耐久性。
Series Name |
C-350 |
C-300L |
C-500 |
C-56 |
|
Interface |
CFA4.1 |
CFA5.0 / CFA6.1 compatible |
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Interface |
True IDE / PC card – Up to |
True IDE / PC card – Up to |
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Connector |
CFC Type I |
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Outline Dimensions |
36.4 x 42.8 x 3.3 mm |
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Flash Type |
SLC |
pSLC |
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Density Range |
32-256 MB |
128 MB-1 GB |
512 MB-64 GB |
4-64 GB |
|
Data Retention |
10 years @ life begin |
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Endurance [DWPD] JESD219 Client Endurance Workload |
max 3.4 |
|
max 3.50 |
max 1.35 |
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Operating Temperature |
Commercial: 0°C to +70°C |
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Storage Temperature |
-40°C to +85°C |
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Performance Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 22 |
up to 22 |
up to 64 |
up to 115 |
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MTBF |
≥ 3,000,000 hours |
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Shock |
1,500 G |
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Vibration |
20 G |
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Humidity |
85 % RH 85°C, 1,000 hrs |
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Voltage |
3.3 V ± 10 % |
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Features & Tools |
Proven Power Fail Safety Security & SBZoneProtection features available SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
Page based FTL for maximum Endurance Proven Power Fail Safety Read Disturb Management TRIM Security & SBZoneProtection features available SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring |
Data Care Management
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
ESD and EMI safe
The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.
Life time monitoring (LTM)
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Power fail protection
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Secure erase (Sanitize / Purge) / Fast erase
This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.
Shock and vibration
Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.
WAF reduction
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Wear leveling
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Wide temperature support
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).