Managed NAND BGAs are the smallest form factor to incorporate reliable and easy to interface storage on a system.
Swissbit offers 2 different e.MMC versions EM-10 and EM-20 and a new PCIe/NVMe BGA for this purpose.
The EM-20/EM-26 e.MMC fulfills the JEDEC 5.0 Standard and offers a reliable and stable storage product with true industrial operating temperature. The EM-10/EM-16 offers a reduced feature set, but allows very fast boot up of instant-on applications.

Series Name

EM-20

EM-26

EM-10

EM-16

Interface

Data Transfer Mode

e.MMC 1-bit, 4-bit, 8-bit up to HS400

e.MMC 1-bit, 4-bit, 8-bit up to SDR-52

Package

153-ball BGA, 0.5mm pitch

Outline Dimensions

11.5mm x 13.0mm x 1mm

Flash Type

MLC

pSLC / enhanced mode

MLC

pSLC / enhanced mode

Density Range

4 GB to 64 GB

2 GB to 32 GB

4 GB to 16 GB

2 GB to 8 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance

3,000 P/E cycles MLC mode
20,000 P/E cycles enhanced mode
(Flash Cell Level)

Operating Temperature

-40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

 

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 


up to 270

up to 160

up to 5,900

up to 2,000

 


up to 270

up to 160

up to 7,000

up to 7,000

 


up to 49

up to 14

up to 3,100

up to 1,110

 


up to 49

up to 31

up to 3,760

up to 1,870

MTBF

~20,000,000 hours

Voltage

VCCQ: 1.70-1.95V / 2.70-3.60V ; VCC: 2.70-3.60

Power Consumption

Typ. Read Current: 180 mA @ 1.8V VCCQ, 38mA @ 3.3V VCC

Typ. Write Current 105 mA @ 1.8V VCCQ, 80mA @ 3.3V VCC

Features & Tools

High performance up to HS400 mode
Sophisticated Wear Levelling & Read Disturb Management
Page based FTL Management
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB

 

Fast boot
Automotive Grade
Read Disturb Management
Page based FTL Management
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB

Detailled S.M.A.R.T. info

Part Number

SFEMxxxGB1EA1TO-I-xx-111-STD

SFEMxxxGB1EA1TO-I-xx-111-Exx

SFEMxxxGB1EM1TO-I-xx-111-STD

SFEMxxxGB1EM1TO-I-xx-11P-STD

 

Product Features

M.2 PCIe BGA

Do you have questions?

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.

Series Name

EN-20

Interface

Data Transfer Mode

PCIe 3.1
NVMe 1.3

Package

BGA 391 ball, 0.8mm pitch

Outline Dimensions

16mm x 20mm x 1.8mm

Flash Type

3D NAND

Density Range

15 GB to 240 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance

3,000 P/E cycles per Flash block

Operating Temperature

-40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Burst Rate

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS

Random 4KB Write (IOPS

 

1,600

650

120,000

150,000

MTBF

~3,000,000 hours

Voltages

3.3V, 1.8V, 0.9V

Power Consumption

Typ. Read Current: tbd

Typ. Write Current tbd

Features & Tools

Dynamic and Static Wear Leveling
Page Mode Flash Translation Layer (FTL)
Data Care Management
Write Amplification Reduction
Power Fail Data Loss Protection
In-Field Firmware Update
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)
AES256 Encryption

Part Number

SFENxxxxGBxEBxss-t-dd-rrr-ccc

 

Product Features