Managed NAND BGAs are the smallest form factor to incorporate reliable and easy to interface storage on a system.
Swissbit offers 2 different e.MMC versions EM-10 and EM-20 and a new PCIe/NVMe BGA for this purpose.
The EM-20/EM-26 e.MMC fulfills the JEDEC 5.0 Standard and offers a reliable and stable storage product with true industrial operating temperature. The EM-10 offers a reduced feature set, but allows very fast boot up of instant-on applications.

Series Name

EM-20

EM-26

EM-10

Interface

Data Transfer Mode

e.MMC 1-bit, 4-bit, 8-bit up to HS400

e.MMC 1-bit, 4-bit, 8-bit up to SDR-52

Package

153-ball BGA, 0.5mm pitch

Outline Dimensions

11.5mm x 13.0mm x 1mm

Flash Type

MLC

pSLC / enhanced mode

MLC

Density Range

4 GB to 64 GB

2 GB to 32 GB

4 GB to 16 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance

3,000 P/E cycles MLC mode
20,000 P/E cycles enhanced mode
(Flash Cell Level)

 

Operating Temperature

Industrial: -40°C to +85°C

-40°C to +105°C

Storage Temperature

-40°C to +85°C

-40°C to +105°C

Performance

Burst Rate

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS)

Random 4KB Write (IOPS)

 

up to 400

up to 270

up to 160

up to 5,100

up to 1,800

 

up to 400

up to 270

up to 160

up to 7,000

up to 7,000

 

up to 52

up to 45

up to 31

up to 2,000

up to 1,850

MTBF

~20,000,000 hours

Voltage

VCCQ: 1.70-1.95V / 2.70-3.60V ; VCC: 2.70-3.60

Power Consumption

Typ. Read Current: 180 mA @ 1.8V VCCQ, 38mA @ 3.3V VCC

Typ. Write Current 105 mA @ 1.8V VCCQ, 80mA @ 3.3V VCC

 

Features & Tools

High performance up to HS400 mode
Sophisticated Wear Levelling & Read Disturb Management
Page based FTL Management
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB

 

Fast boot
Automotive Grade
Read Disturb Management
Page based FTL Management
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB

Detailled S.M.A.R.T. info

Part Number

SFEMxxxGB1EA1TO-I-xx-111-STD

SFEMxxxGB1EA1TO-I-xx-111-Exx

SFEMxxxGB1EA1TO-I-xx-111-STC

 

Product Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows predicting imminent failure avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection & Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Read-only optimized
Read only optimized

In many industrial applications the data is written to the NAND Flash once and is only read afterwards. For such cases the firmware can be optimized in order to guarantee highest possible data retention and less read disturb.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling & Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory & storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).

M.2 PCIe BGA

Do you have questions?

The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilisation even for sparsely writing allpications.

Series Name

EN-20

Interface

Data Transfer Mode

PCIe 3.1
NVMe 1.3

Package

BGA 391 ball, 0.8mm pitch

Outline Dimensions

16mm x 20mm x 1.8mm

Flash Type

3D NAND

Density Range

15 GB to 240 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance

3,000 P/E cycles per Flash block

Operating Temperature

-40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Burst Rate

Sequential Read (MB/s)

Sequential Write (MB/s)

Random 4KB Read (IOPS

Random 4KB Write (IOPS

 

1,600

650

120,000

150,000

MTBF

~3,000,000 hours

Voltages

3.3V, 1.8V, 0.9V

Power Consumption

Typ. Read Current: tbd

Typ. Write Current tbd

Features & Tools

Dynamic and Static Wear Leveling
Page Mode Flash Translation Layer (FTL)
Data Care Management
Write Amplification Reduction
Power Fail Data Loss Protection
In-Field Firmware Update
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)
AES256 Encryption

Part Number

SFENxxxxGBxEBxss-t-dd-rrr-ccc

 

Product Features

Data care management
Data Care Management

Various effects like data retention, read disturb limits or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows predicting imminent failure avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection & Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling & Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory & storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).