小型嵌入式系統通常採用 NAND 元件，這些元件由主控制器軟體直接進行介面連接與管理。隨著 NAND 元件及其管理複雜度不斷增加，這項任務已變得頗具挑戰性。管理型 NAND 正是解決之道：一個小型 BGA 元件整合了多個快閃記憶體晶片、NAND 控制器及管理韌體，從而簡化了整合流程。 Swissbit 的 e.MMC EM-20、EM-30 及 M1x00 系列產品涵蓋多種儲存容量與介面速度。憑藉其先進的 NAND 管理功能，e.MMC 非常適合 POS/POI、PLC、物聯網、遊戲、醫療等應用，亦可作為嵌入式應用的通用啟動介質。
| EM-30 (153-b) | EM-36 (153-b) | EM-30 (100-b) | EM-36 (100-b) | M1100 | M1700 | EM-20 | EM-26 | |
|---|---|---|---|---|---|---|---|---|
| Series Name | EM-30 | EM-36 | EM-30 | EM-36 | M1100 | M1700 | EM-20 | EM-26 |
| Standards / Compliance | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.0 | JEDEC e.MMC 5.0 |
| Interface / Protocol | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit |
| Data Transfer Mode | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 |
| Connector | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 100-ball BGA, 1mm pitch | 100-ball BGA, 1mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch |
| Outline Dimensions (LxWxH) | 11.5 x 13 x 1.2 mm | 11.5 x 13 x 1.2 mm | 14.0 x 18 x 1.4 mm | 14.0 x 18 x 1.4 mm | 11.5 x 13.1 x 1.0 mm | 11.5 x 13.1 x 1.0 mm | 11.5 x 13.0 x 1.0 mm | 11.5 x 13.0 x 1.0 mm |
| Flash Type | 3D TLC | 3D pSLC reliable mode | 3D TLC | 3D pSLC reliable mode | MLC | pSLC reliable mode | MLC | pSLC reliable mode |
| Density Range | 4-256 GB | 5-80 GB | 4-256 GB | 5-80 GB | 8 GB | 4 GB | 4-64 GB | 2-32 GB |
| Data Retention | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end |
| Operating Temperature (ambient) | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C |
| Storage Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| Voltages | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 |
| Average Power | 0.22 W | 0.21 W | 0.22 W | 0.21 W | 0.18 W | 0.17 W | 0.25 W | 0.25 W |
| Features & Tools | High performance up | High performance up | High performance up | High performance up | Power-fail data loss | Power-fail data loss | High performance up | High performance up |
| Endurance P/E cycles | 3k | 20k | ||||||
| Endurance [DWPD] max | up to 0.79 | up to 29.7 | up to 0.79 | up to 29.7 | 0.95 | 30 | ||
| Sequential Read (MB/s) | up to 320 | up to 330 | up to 320 | up to 330 | up to 297 | up to 292 | up to 175 | up to 240 |
| Sequential Write (MB/s) | up to 240 | up to 250 | up to 240 | up to 250 | up to 117 | up to 119 | up to 21 | up to 120 |
| Random 4KB Read (IOPS) | up to 4,600 | up to 4,600 | up to 4,600 | up to 4,600 | up to 4,800 | up to 17,300 | up to 3,800 | up to 6,700 |
| Random 4KB Write (IOPS) | up to 2,900 | up to 2,900 | up to 2,900 | up to 2,900 | up to 1,950 | up to 12,500 | up to 1,400 | up to 6,700 |
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