小型嵌入式系统通常采用NAND器件，这些器件由主控制器软件直接进行接口连接和管理。随着NAND器件及其管理复杂性的不断增加，这项任务已变得颇具挑战性。管理型NAND正是解决之道：一个小型BGA器件集成了多个闪存芯片、NAND控制器和管理固件，从而简化了集成过程。 Swissbit的e.MMC EM-20、EM-30和M1x00系列产品涵盖多种存储容量和接口速度。凭借其先进的NAND管理功能，e.MMC非常适合POS/POI、PLC、物联网、游戏、医疗等应用，也可作为嵌入式应用的通用启动介质。
| EM-30 (153-b) | EM-36 (153-b) | EM-30 (100-b) | EM-36 (100-b) | M1100 | M1700 | EM-20 | EM-26 | |
|---|---|---|---|---|---|---|---|---|
| Series Name | EM-30 | EM-36 | EM-30 | EM-36 | M1100 | M1700 | EM-20 | EM-26 |
| Standards / Compliance | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.1 | JEDEC e.MMC 5.0 | JEDEC e.MMC 5.0 |
| Interface / Protocol | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit | e.MMC 1-bit, 4-bit, 8-bit |
| Data Transfer Mode | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 | up to HS400 |
| Connector | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 100-ball BGA, 1mm pitch | 100-ball BGA, 1mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch | 153-ball BGA, 0.5mm pitch |
| Outline Dimensions (LxWxH) | 11.5 x 13 x 1.2 mm | 11.5 x 13 x 1.2 mm | 14.0 x 18 x 1.4 mm | 14.0 x 18 x 1.4 mm | 11.5 x 13.1 x 1.0 mm | 11.5 x 13.1 x 1.0 mm | 11.5 x 13.0 x 1.0 mm | 11.5 x 13.0 x 1.0 mm |
| Flash Type | 3D TLC | 3D pSLC reliable mode | 3D TLC | 3D pSLC reliable mode | MLC | pSLC reliable mode | MLC | pSLC reliable mode |
| Density Range | 4-256 GB | 5-80 GB | 4-256 GB | 5-80 GB | 8 GB | 4 GB | 4-64 GB | 2-32 GB |
| Data Retention | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end |
| Operating Temperature (ambient) | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C
Automotive: -40°C to +105°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C |
| Storage Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| Voltages | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 | VCCQ: 1.70-1.95V / 2.70-3.60V
VCC: 2.70-3.60 |
| Average Power | 0.22 W | 0.21 W | 0.22 W | 0.21 W | 0.18 W | 0.17 W | 0.25 W | 0.25 W |
| Features & Tools | High performance up | High performance up | High performance up | High performance up | Power-fail data loss | Power-fail data loss | High performance up | High performance up |
| Endurance P/E cycles | 3k | 20k | ||||||
| Endurance [DWPD] max | up to 0.79 | up to 29.7 | up to 0.79 | up to 29.7 | 0.95 | 30 | ||
| Sequential Read (MB/s) | up to 320 | up to 330 | up to 320 | up to 330 | up to 297 | up to 292 | up to 175 | up to 240 |
| Sequential Write (MB/s) | up to 240 | up to 250 | up to 240 | up to 250 | up to 117 | up to 119 | up to 21 | up to 120 |
| Random 4KB Read (IOPS) | up to 4,600 | up to 4,600 | up to 4,600 | up to 4,600 | up to 4,800 | up to 17,300 | up to 3,800 | up to 6,700 |
| Random 4KB Write (IOPS) | up to 2,900 | up to 2,900 | up to 2,900 | up to 2,900 | up to 1,950 | up to 12,500 | up to 1,400 | up to 6,700 |
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