System-in-Package (SiP) is the processing of sensitive bare dies or chips into robust finished modules or components. With 20 years of experience, Swissbit successfully uses advanced packaging technologies in order to achieve smallest form factors and to build Multi-Chip-Packages. With this electronic integration approach our products provide more functionality or highest memory densities inside one package. Here various functional blocks (RF, digital, sensors, security and memory) are combined, as well as passive components.
Beginning with the wafer and bare die handling, Swissbit utilizes a flexible chip on board (COB) assembly and packaging line. Processes like SMT assembly, die bonding, Au and Al wire bonding, dam & fill, transfer molding, precise separation with laser technology and sawing, housing, labeling, laser marking etc. are very well established.
Die stacking, especially for Flash and DRAM, is one of our expertise besides the integration of additional hardware features and an experienced team of testing and quality engineers. Our own Memory-In-Package line qualifies (but does not limit) Swissbit as the development and production partner for any dedicated or customized memory–related product with challenging integration or reliability requirements. If you cannot achieve the special demands regarding space and performance using traditional components and processes, Swissbit offers feasibility studies, manages or supports your development project and produces prototypes and small and mid-size volumes (up to 50’000 pieces / month). We will aid you from the time of inception of your project: from the design phase, prototyping, determining the circuit layout and material selection, to preparing the appropriate packaging for transport.
Swissbit produces and develops according to ISO 9001:2008, IATF 16949 and ISO 14001 approved processes and is an experienced partner of global industrial and automotive accounts. Swissbit ́s technology portfolio combined with its strong engineering know- how and experience enables new innovative MCP (Multi Chip Packages) / SiP / COB configurations, like stacked dice, side-by-side, sensors integration etc.
System in Package solutions can be smaller, cheaper and have higher security.
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