Swissbit SIP competency

System-in-Package (SiP) is the processing of sensitive bare dies or chips into robust finished modules or components.

With 25 years of experience, Swissbit successfully uses advanced packaging technologies to achieve the smallest form factors and to build multi-chip packages.


With this electronic integration approach, our products provide more functionality inside one package, various functional blocks (RF, digital, sensors, security, and memory) as well as passive components are combined.
Having all the necessary capabilities inhouse we have the best design for reliability, test and production. For our memory products we developed processes for stacking multiple large dies and wire bonding the smallest bond pads.
Swissbit´s technology portfolio combined with its strong engineering know-how and experience enables new, innovative MCP (Multi Chip Packages) / SiP / COB configurations like stacked dies, side-by-side, sensors integration, and much more.


Our customers benefit from reduced development cost and higher yields and reliability.
We use advanced packaging technology, which allows production of small volume series (up to 50,000 pieces/month) with short lead-times and in-time delivery.


Swissbit produces and develops according to ISO 9001:2015, IATF 16949, ISO 50001:2011 and ISO 14001:2015 approved processes and is an experienced partner in global industrial and automotive accounts.

SYSTEM-IN-PACKAGE BENEFITS:

• reduced process complexity
• lower TCO (Total Cost of Ownership)
• reduced system board space
• layer count reduction of system pcb
• reduced board mounted height
• mixed analog / digital design
• reduced system board test complexity

Capabilities

SIP Features

Substrate PCB
Substrate / PCB

• Fine etch
• Low overall thickness

Surface-mount technology
SMT

• 01005 passives
• Cleaning

Surface-mount technology
Die attach

• DAF tape
• Stencil print
• Dispensing

Die bonding
Die bonding

• Multi & single chip
• Thin die (> 50um)
• Large die 15 x 15 mm

Wire bonding
Wire bonding

• Au, Ag-alloy, Al wire
• 17.5 – 32 um wire
• Chain bonding

Encapsulation
Encapsulation

• Dam & Fill
• Underfill
• Glob top

Transfer molding
Transfer molding

• Large area map
• Top-foil
• MicroSD, BGA, LGA

Singulation
Singulation

• Sawing
• Laser cutting

Marking
Marking

• Laser marking
• Tampon print
• Labelling