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以上\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>レーザーダイシングおよびブレードダイシングによるクリーンなエッジ\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>大型ダイの取り扱い：最大15×15mm\u003C\u002Fp>\u003C\u002Fli>\u003C\u002Ful>",{"icon":157,"title":159,"short-description":160},{"type":35,"svg":36,"sprite-id":158},"die-attach","ダイアタッチ／接着剤塗布","\u003Cp>5µm未満の精度でダイを配置できるため、高密度パッケージにおいてダイ間の間隔を狭くすることが可能です。\u003C\u002Fp>\u003Cul>\u003Cli>\u003Cp>5µm未満の配置精度\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>熱管理用エポキシおよびフィルム系接着剤\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>均一なボンディングラインを実現する自動ディスペンシング\u003C\u002Fp>\u003C\u002Fli>\u003C\u002Ful>",{"icon":162,"title":164,"short-description":165},{"type":35,"svg":36,"sprite-id":163},"die-bonding","チップボンディング／ダイスタッキング","\u003Cp>マルチチップ・ダイボンダーは、メモリの積層（最大16個のNANDダイ）と、ロジック、メモリ、センサーを組み合わせた複雑なヘテロジニアス・レイアウトの両方に対応しています。\u003C\u002Fp>\u003Cul>\u003Cli>\u003Cp>垂直積層：最大密度を実現する最大16個のダイ\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>混合集積のためのサイド・バイ・サイド配置\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>ダイ間アライメント：2µm未満の精度\u003C\u002Fp>\u003C\u002Fli>\u003C\u002Ful>",{"icon":167,"title":169,"short-description":170},{"type":35,"svg":36,"sprite-id":168},"wire-bonding","ワイヤボンディング","\u003Cp>ファインピッチ・ワイヤボンディング（ピッチ40µm）では、金、銅、銀合金、またはアルミニウム製のワイヤを用いて、すべてのダイを基板に接続します。これは、スイスビットのベルリン拠点における中核的な技術であり、同拠点では毎日数千件の接続処理を行っています。\u003C\u002Fp>\u003Cul>\u003Cli>\u003Cp>ワイヤ径：15～32µm\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>ファインピッチ：40µm（30\u002F60µmのスタッガード）\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>様々な用途に対応するボール＆ウェッジボンディング\u003C\u002Fp>\u003C\u002Fli>\u003C\u002Ful>",{"icon":172,"title":174,"short-description":175},{"type":35,"svg":36,"sprite-id":173},"flip-chip","フリップチップ","\u003Cp>高密度配線と優れた放熱性能が求められる高I\u002FOアプリケーション向けの高度なフリップチップ実装。\u003C\u002Fp>\u003Cul>\u003Cli>\u003Cp>ファインピッチ用途向けのマイクロバンプ実装\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>実装時のアンダーフィル統合\u003C\u002Fp>\u003C\u002Fli>\u003Cli>\u003Cp>ダイと基板の直接接触による熱設計の最適化\u003C\u002Fp>\u003C\u002Fli>\u003C\u002Ful>",{"icon":177,"title":179,"short-description":180},{"type":35,"svg":36,"sprite-id":178},"balling","ボールリング","\u003Cp>リフローはんだ付け前のインライン検査および修復工程を備えた、250µmまでのボールサイズに対応する自動ボール形成プロセス。プレフォームを使用することで、最高精度かつボイドのないBGAボールを実現。ボール形成工程後の100%自動光学検査および洗浄を実施。\u003C\u002Fp>",{"icon":182,"title":184,"short-description":185},{"type":35,"svg":36,"sprite-id":183},"substrate-pcb","IC／高度な基板","\u003Cp>微細配線（35\u002F35µm）および複雑な積層構造に対応した自社開発の基板設計・加工技術により、異種SiP向けのカスタム配線を実現します。\u003C\u002Fp>\u003Cul>\u003Cli>\u003Cp>微細配線：高密度配線用 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Chip（SoC）とどう違うのですか？","\u003Cp>SoCは製造工程においてすべての機能を単一のシリコンダイに集積するものであり、多大な開発投資を要するカスタム半導体アプローチです。一方、SiPは個別のダイを1つのパッケージに統合するもので、実績のあるコンポーネントを使用する産業用アプリケーションにおいて、より柔軟でコスト効率の高いアプローチとなります。\u003C\u002Fp>",{"icon":373,"headline":374,"text":375},{"type":35,"svg":36,"sprite-id":36},"どのSwissbit製品がSiP技術を採用していますか？","\u003Cp>多くのSwissbit製品はSiP製造技術を採用しています。具体的には、EM-30 e.MMCモジュール（NANDフラッシュとコントローラの統合）、iShield Key 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