Swissbit System-in-Package Competency

System-in-Package (SiP) is the processing of sensitive bare dies or chips into robust finished modules or components.

From the very beginning, Swissbit successfully uses advanced packaging technologies to achieve the smallest form factors and to build multi-chip packages.

With this electronic integration approach, our products provide more functionality inside one package, various functional blocks (RF, digital, sensors, security, and memory) as well as passive components are combined.
Having all the necessary capabilities in-house we have the best design for reliability, test and production. For our memory products we developed processes for stacking multiple large dies and wire bonding the smallest bond pads.
Swissbit´s technology portfolio combined with its strong engineering know-how and experience enables new, innovative MCP (Multi Chip Packages) / SiP / COB configurations like stacked dies, side-by-side, sensors integration, and much more.

Our customers benefit from reduced development cost and higher yields and reliability.
We use advanced packaging technologies, which allows mass customization with production of small, moderate or high volume series with short lead-times and in-time delivery.

Swissbit produces and develops according to ISO 9001, IATF 16949, ISO 27001 and ISO 14001 approved processes and is an experienced partner in global industrial and automotive accounts.

System-in-Package Benefits:

• reduced process complexity
• lower TCO (Total Cost of Ownership)
• reduced system board space
• layer count reduction of system PCB
• reduced board mounted height
• mixed analog / digital design
• reduced system board test complexity


SIP Features

Substrate PCB
Substrate / PCB

• Fine line 35 / 35 µm
• Overall thickness from 130µm to 2.5mm

Surface-mount technology

• 01005 passives
• Cleaning

Die attach
Die Attach

• DAF tape
• Stencil print
• Dispensing

Die bonding
Die Bonding

• Multi & single chip
• Thin die (>40um)
• Large die up to 15 x 15 mm or more

Wire bonding
Wire Bonding

• Au, Ag-alloy, Cu, Al wire
• 15 – 32 um wire
• Chain bonding


• Dam & Fill
• Underfill
• Glob top

Transfer molding
Transfer Molding

• Large area map
• Top-foil
• MicroSD, BGA, LGA & QFN toolset


• Dicing saw
• Laser cutting
• Milling


• Laser marking
• Tampon print
• Digital UV ink-Jet
• Labelling