e.MMC
Do you have questions?
EM-10 / EM-16 e.MMC 4.41
- JEDEC eMMC 4.41 Standard (JESD84- A441)
- 153-ball BGA, 0.5mm pitch
- 11.5 x 13mm RoHS compliant
- Operational Temperature Range -40°C to 105°C
- AEC - Q100 Grade 2 qualified
- Fast Boot feature for instant-up applications
- Replaces NOR & NAND flash combination
- MLC and pSLC (Enhanced Mode) option
- Detailed S.M.A.R.T information
EM-20 / EM-26 e.MMC 5.0
- JEDEC e.MMC 5.0 Standard (JESD84-B50)
- 153-ball BGA, 0.5mm pitch 11.5 x 13mm
- Operational Temperature Range -40°C to 85°C
- Multiple partitions in MLC and Reliable mode configurable (EM-20)
- Preconfigured in 100% Reliable mode (EM-26)
- High performance e.MMC 5.0 support
- Read disturb managed
- Power fail protected
Managed NAND BGAs are the smallest form factor to incorporate reliable and easy to interface storage on a system.
Swissbit offers 2 different e.MMC versions EM-10 and EM-20 and a new PCIe/NVMe BGA for this purpose.
The EM-20/EM-26 e.MMC fulfills the JEDEC 5.0 Standard and offers a reliable and stable storage product with true industrial operating temperature. The EM-10/EM-16 offers a reduced feature set, but allows very fast boot up of instant-on applications.
|
Series Name |
EM-20 |
EM-26 |
EM-10 |
EM-16 |
|
Interface Data Transfer Mode |
e.MMC 1-bit, 4-bit, 8-bit up to HS400 |
e.MMC 1-bit, 4-bit, 8-bit up to SDR-52 |
||
|
Package |
153-ball BGA, 0.5mm pitch |
|||
|
Outline Dimensions |
11.5mm x 13.0mm x 1mm |
|||
|
Flash Type |
MLC |
pSLC / enhanced mode |
MLC |
pSLC / enhanced mode |
|
Density Range |
4 GB to 64 GB |
2 GB to 32 GB |
4 GB to 16 GB |
2 GB to 8 GB |
|
Data Retention |
10 years @ life begin |
|||
|
Endurance |
3,000 P/E cycles MLC mode |
|||
|
Operating Temperature |
-40°C to +85°C |
|||
|
Storage Temperature |
-40°C to +85°C |
|||
|
Performance
Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS) Random 4KB Write (IOPS) |
up to 21 up to 3,800 up to 1,400 |
up to 120 up to 6,700 up to 6,700 |
up to 14 up to 3,100 up to 1,110 |
up to 31 up to 3,760 up to 1,870 |
|
MTBF |
~20,000,000 hours |
|||
|
Voltage |
VCCQ: 1.70-1.95V / 2.70-3.60V ; VCC: 2.70-3.60 |
|||
|
Power Consumption |
Typ. Read Current: 180 mA @ 1.8V VCCQ, 38mA @ 3.3V VCC Typ. Write Current 105 mA @ 1.8V VCCQ, 80mA @ 3.3V VCC |
|||
|
Features & Tools |
High performance up to HS400 mode |
Fast boot |
||
|
Part Number |
SFEMxxxGB1EA1TO-I-xx-111-STD |
SFEMxxxGB1EA1TO-I-xx-111-Exx |
SFEMxxxGB1EM1TO-I-xx-111-STD |
SFEMxxxGB1EM1TO-I-xx-11P-STD |
Product Features
Data Care Management
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
Life time monitoring (LTM)
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Power fail protection
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
WAF reduction
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Wear leveling
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Wide temperature support
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).
M.2 PCIe BGA
Do you have questions?
EN-20 M.2 PCIe
- PCIe M.2 1620 BGA
- PCIe Gen 3.1 / NVMe 1.3 4 lanes
- BGA, 0.8mm pitch 16 x 20mm
- 3D NAND
- Operational Temperature Range -40°C to 85°C
- Data Care Management
- Power fail protected
- AES 256 encryption
The EN-20 is a PCIe 3.1 /NVMe 1.3 product with DRAM support and up to 4 lane operation mode offers both a high performance and short latency for modern applications. Data care management with background adaptive read refresh and media scan maintains the retention of the Flash blocks and enables long product utilization even for sparsely writing applications.
|
Series Name |
EN-20 |
|
Interface Data Transfer Mode |
PCIe 3.1 |
|
Package |
BGA 391 ball, 0.8mm pitch |
|
Outline Dimensions |
16mm x 20mm x 1.8mm |
|
Flash Type |
3D NAND |
|
Density Range |
15 GB to 240 GB |
|
Data Retention |
10 years @ life begin |
|
Endurance |
3,000 P/E cycles per Flash block |
|
Operating Temperature |
-40°C to +85°C |
|
Storage Temperature |
-40°C to +85°C |
|
Performance Burst Rate Sequential Read (MB/s) Sequential Write (MB/s) Random 4KB Read (IOPS Random 4KB Write (IOPS |
1,600 650 120,000 150,000 |
|
MTBF |
~3,000,000 hours |
|
Voltages |
3.3V, 1.8V, 0.9V |
|
Power Consumption |
Typ. Read Current: tbd Typ. Write Current tbd |
|
Features & Tools |
Dynamic and Static Wear Leveling |
|
Part Number |
SFENxxxxGBxEBxss-t-dd-rrr-ccc |
Product Features
Data Care Management
Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.
Life time monitoring (LTM)
The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.
Power fail protection
Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.
Secure erase (Sanitize / Purge) / Fast erase
This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.
Temperature sensor
The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.
Trim support
The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.
WAF reduction
The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.
Wear leveling
Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.
Wide temperature support
Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).