Für industrielle und Embedded-Anwendungen bietet Swissbit kompakte PCIe M.2 Module in den Formfaktoren 2242 und 2230 an, die für platzsparende Designs optimiert sind. Die Serien N7000 und N2000 gewährleisten einen zuverlässigen Betrieb und hohe Spitzenleistung durch die Unterstützung des Host Memory Buffer (HMB) in Kombination mit einem pSLC-Cache. Dies ermöglicht schnelle sequenzielle Lese- und Schreibgeschwindigkeiten bei geringem Stromverbrauch und kompakter Wärmebudget. Die N3000-Serie mit integriertem DRAM richtet sich an leistungskritische Designs und bietet niedrige Latenz, konsistentes Random-Write-Verhalten und stabilen Durchsatz für rechenintensive Workloads. Alle Swissbit PCIe-M.2-Module verfügen über die bewährten Swissbit-Industriefunktionen, darunter fortschrittliches Temperatur-, Datenerhalt- und Sicherheitsmanagement für einen stabilen Betrieb unter anspruchsvollen Bedingungen. Für missionskritische Anwendungen mit kontinuierlicher Schreibaktivität und strengen Anforderungen an die Datenintegrität bieten die Langzeitvarianten N7600 und N2600 eine hohe DWPD-Belastbarkeit und eine verlängerte Lebensdauer.
| N7600 (2242) | N7000 (2242) | N3000 (2242) | N2600 (2242) | N2600 (2230) | N2000 (2242) | N2000 (2230) | N-20m2 (2242) | |
|---|---|---|---|---|---|---|---|---|
| Series Name | N7600 | N7000 | N3000 | N2600 | N2600 | N2000 | N2000 | N-20m2 |
| Package | M.2 2242 | M.2 2242 | M.2 2280 | M.2 2242 | M.2 2230 | M.2 2242 | M.2 2230 | M.2 2242 |
| Standards / Compliance | PCIe 4.0 / NVMe 2.0 | PCIe 4.0 / NVMe 2.0 | PCIe 4.0 / NVMe 1.4 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 |
| Interface / Protocol | x4 lanes / NVMe 2.0 | x4 lanes / NVMe 2.0 | x4 lanes / NVMe 1.4 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 |
| Outline Dimensions (LxWxH) | 42 x 22 x 3.58 mm | 42 x 22 x 3.58 mm | 42 x 22 x 3.58 mm | 42 x 22 x 3.5 mm | 30 x 22 x 3.5 mm | 42 x 22 x 3.5 mm | 30 x 22 x 3.5 mm | 30 x 22 x 3.5 mm |
| Connector | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key |
| Flash Type | 3D NAND pSLC | 3D NAND TLC | 3D NAND TLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND TLC | 3D NAND TLC | 3D NAND TLC |
| Density Range | 80 GB - 1.28 TB | 240 GB - 1.92 TB | 240 GB – 3.84 TB | 20 GB - 160 GB | 20 GB - 160 GB | 15 GB - 480 GB | 60 GB - 480 GB | 15 GB - 480 GB |
| Data Retention | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en |
| Endurance [DWPD] Enterprise WL | max. 10 | max 0.3 | max 0.85 @ 3y | up to 12.8 | Up to 9.1 | up to 0.36 | up to 0.36 | max. 0.32 |
| Operating Temperature (ambient) | Commercial: 0°C to +70°C
Industrial: -40°C to +85°C | Commercial: 0°C to +70°C
Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Commercial: 0°C to +70°C
Industrial: -40°C to +85°C |
| Storage Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| DRAM | HMB Support | HMB Support | DRAM buffer | HMB support | HMB support | HMB support | HMB support | HMB support |
| Powerloss Protection | By firmware | By firmware | By firmware | By firmware | By firmware | By firmware | By firmware | By firmware |
| MTBF | > 3,000,000 hours | > 3,000,000 hours | > 3,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours |
| Data Reliability | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read |
| Shock | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms |
| Vibration | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz |
| Humidity | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs |
| Voltages | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 |
| Average Power | 3.7 W | 3.7 W | 3.9 W | 2.7 W | 2.7 W | 2.7 W | 2.7 W | 2.97 W |
| Features & Tools | NVMe-MI 1.2 support
Out of Band | NVMe-MI 1.2 support
Out of Band | Active and Passive D | Active and Passive D | Active and Passive D | Active and Passive D | Active and Passive D | Active and Passive D |
| Sequential Read (MB/s) | up to 6,660 | up to 6,660 | up to 3,850 | up to 1,750 | up to 1,750 | up to 1,775 | up to 1,770 | up to 1,775 |
| Sequential Write (MB/s) | up to 6,150 | up to 6,150 | up to 3,340 | up to 830 | up to 867 | up to 864 | up to 830 | up to 864 |
| Random 4KB Read (IOPS) | up to 608k | up to 608k | up to 456,000 | up to 140,000 | up to 140,000 | up to 140,000 | up to 140,000 | up to 140,000 |
| Random 4KB Write (IOPS) | up to 958k | up to 958k | up to 505,000 | up to 130,000 | up to 130,000 | up to 134,000 | up to 130,000 | up to 134,000 |
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