Die PCIe-Schnittstelle mit NVMe-Protokoll ist der neue Standard für Konsumer-, Enterprise- und Embedded Anwendungen. Obwohl alle das gleiche SSD-Design nutzen, unterscheiden sich ihre Anforderungen erheblich. Während bei Client- und Enterprise-Anwendungen hohe Kapazität und Geschwindigkeit im Vordergrund stehen, erfüllen diese Produkte oft nicht die Anforderungen an hohe Lebensdauer.
Swissbit begegnet diesem Bedarf mit seinen High-Enurance PCIe M.2 SSDs, die für Anwendungen mit hohem Schreibaufkommen oder extremen Lebensdaueranforderungen ausgelegt sind. Mit pSLC- oder Enterprise-TLC-Technologie bieten diese SSDs von einem bis zu zehn vollständigen Schreibzyklen pro Tag über einen Zeitraum von fünf Jahren unter Enterprise-Workload-Bedingungen.
Die A1200- und A2200-Serien bieten hohe Leistung, Temperatur- und Datenpflege-Management und umfassende Sicherheitsoptionen. Die N7600- und N2600-Serien sind ideal für Anwendungen mit begrenztem Energiebedarf. Alle Serien spiegeln die typischen Werte von Swissbit wider.
| A2200 (2280) | N3602 (2280) | N7600 (2280) | N2600 (2280) | N2600 (2242) | N2600 (2230) | N-16m2 (2280) | |
|---|---|---|---|---|---|---|---|
| Series Name | A2200 M.2 | N3602 | N7600 | N2600 | N2600 | N2600 | N-16m2 |
| Package | M.2 2280 | M.2 2280 | M.2 2280 | M.2 2280 | M.2 2242 | M.2 2230 | M.2 (2280) |
| Standards / Compliance | PCIe Gen 4.0 x4 / NVMe 1.4 | PCIe 4.0 / NVMe 1.4 | PCIe 4.0 / NVMe 2.0 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.3 | PCIe 3.1 / NVMe 1.2 |
| Interface / Protocol | x4 lanes / NVMe 1.4 | x4 lanes / NVMe 1.4 | x4 lanes / NVMe 2.0 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 | x4 lanes / NVMe 1.3 | x2 lanes / NVMe 1.2 |
| Outline Dimensions (LxWxH) | 80 x 22 x 3.58 mm | 80 x 22 x 3.58 mm | 80 x 22 x 3.58 mm | 80 x 22 x 3.5 mm | 42 x 22 x 3.5 mm | 30 x 22 x 3.5 mm | 80 x 22 x 3.5 mm |
| Connector | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
M key | 75 pos. Edge Connector
B&M key |
| Flash Type | 3D NAND eTLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND pSLC |
| Density Range | 480 GB – 3,84 TB | 80 GB – 320 GB | 80 GB - 1.28 TB | 20 GB - 160 GB | 20 GB - 160 GB | 20 GB - 160 GB | 20 GB - 320 GB |
| Data Retention | 3 months @ 40 °C at EOL | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en | 10 years @ life begin
1 year @ life en |
| Endurance [DWPD] Enterprise WL | 1.0 for 5 years | max. 14.8 @ 3y | max. 10 | up to 12.8 | up to 12.8 | Up to 9.1 | up to 6.4 |
| Operating Temperature (ambient) | Commercial: 0°C to +70°C
Extended: -25°C to +85°C | Industrial: -40°C to +85°C | Commercial: 0°C to +70°C
Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Industrial: -40°C to +85°C | Commercial: 0°C to +70°C
Industrial: -40°C to +85°C |
| Storage Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| DRAM | DDR4 DRAM | DRAM buffer | HMB Support | HMB support | HMB support | HMB support | DDR3 |
| Powerloss Protection | By firmware | HW powersafe™ | By firmware | By firmware | By firmware | By firmware | By firmware |
| MTBF | > 2,500,000 hours | > 3,000,000 hours | > 3,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours |
| Data Reliability | < 1 sector per 10^17 bits | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read | <1 Sector per 10^16 Read |
| Shock | 1,000g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms | 1,500g, 0.5 ms |
| Vibration | 20 g, 20 - 2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz | 50g, 80-2,000 Hz |
| Humidity | 5 to 95% r.h. | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs | 85% RH 85 °C, 1000 hrs |
| Voltages | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 | VCC: 2.70 – 3.60 |
| Average Power | < 10 W | 4.1 W | 3.7 W | 2.7 W | 2.7 W | 2.7 W | 3.7 W |
| Features & Tools | E2E Data Protection
S.M.A.R.T | Active and Passive D | NVMe-MI 1.2 support
Out of Band | Active and Passive D | Active and Passive D | Active and Passive D | Active and Passive D |
| Sequential Read (MB/s) | up to 6,410 | up to 3,850 | up to 6,660 | up to 1,770 | up to 1,750 | up to 1,750 | up to 1,600 |
| Sequential Write (MB/s) | up to 4,810 | up to 3,350 | up to 6,150 | up to 830 | up to 830 | up to 867 | up to 1,050 |
| Random 4KB Read (IOPS) | up to 1,070k | up to 393,000 | up to 608k | up to 140,000 | up to 140,000 | up to 140,000 | up to 190,000 |
| Random 4KB Write (IOPS) | up to 844k | up to 516,000 | up to 958k | up to 130,000 | up to 130,000 | up to 130,000 | up to 190,000 |
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