PCIe-BGAs mit HMB-Unterstützung und einem Betriebsmodus mit bis zu 4 Lanes bieten sowohl hohe Leistung als auch kurze Latenzzeiten für moderne Anwendungen. Die Firmware ist auf industrielle Systeme mit großem Temperaturbereich, hoher Lebensdauer und Datenhaltbarkeit ausgelegt. Die Versionen EN-20, E2000 und E7000 bieten hohe Kapazität durch den Einsatz von 3D-NAND-TLC-Flash, während die Modelle EN-26, E2600 und E7600 im pSLC-Modus arbeiten und höchste Datenbeständigkeit und Zuverlässigkeit bieten.
| E2000 | EN-20 | E2600 | EN-26 | E7000 | E7600 | |
|---|---|---|---|---|---|---|
| Series Name | E2000 | EN-20 | E2600 | EN-26 | E7000 | E7000 |
| Standards / Compliance | PCIe Gen 3.1 | PCIe Gen 3.1 | PCIe Gen 3.1 | PCIe Gen 3.1 | PCIe Gen 4 | PCIe Gen 4 |
| Interface / Protocol | PCIe 4 lanes / NVMe 1.3 | PCIe 4 lanes / NVMe 1.3 | PCIe 4 lanes / NVMe 1.3 | PCIe 4 lanes / NVMe 1.3 | PCIe 4 lanes / NVMe 2.0 | PCIe 4 lanes / NVMe 2.0 |
| Data Transfer Mode | 4 GB/s | 4 GB/s | 4 GB/s | 4 GB/s | 4 GB/s | 4 GB/s |
| Connector | BGA 291 ball, 0.8mm pitch | BGA 291 ball, 0.8mm pitch | BGA 291 ball, 0.8mm pitch | BGA 291 ball, 0.8mm pitch | BGA 291 ball, 0.8mm pitch | BGA 291 ball, 0.8mm pitch |
| Outline Dimensions (LxWxH) | 16mm x 20mm x 1.8mm | 16mm x 20mm x 1.8mm | 16mm x 20mm x 1.8mm | 16mm x 20mm x 1.8mm | 16mm x 20mm x 1.8mm | 16mm x 20mm x 1.8mm |
| Flash Type | 3D NAND TLC | 3D NAND TLC | 3D NAND pSLC | 3D NAND pSLC | 3D NAND TLC | 3D NAND pSLC |
| Density Range | 60-480 GB | 4-256 GB | 20-160 GB | 5-80 GB | 120-1920 GB | 40-640 GB |
| DRAM | no | no | no | no | no | no |
| Endurance [DWPD] Client WL or Random 128K | up to 2.1 | up to 0.9 | up to 79 | 17.7 | up to 0.3 | up to 10 |
| Data Retention | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end | 10 years @ life begin
1 year @ life end |
| Operating Temperature (ambient) | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| Storage Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
| MTBF | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours | > 2,000,000 hours |
| Data Reliability | < 1 sector per 10^16 bits | < 1 sector per 10^16 bits | < 1 sector per 10^16 bits | < 1 sector per 10^16 bits | < 1 sector per 10^16 bits | < 1 sector per 10^16 bits |
| Voltages | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% | 3.3V ±5%, 1.8V ±5%, 0.9V ±5% |
| Average Power | 2.1 W | 1.7 W | 2.2 W | 1.8 W | ||
| Features & Tools | HMB support
Dynamic | HMB support
Dynamic | HMB support
Dynamic | HMB support
Dynamic | HMB support
Power Fa | HMB support
Power Fa |
| Sequential Read (MB/s) | up to 1,750 | up to 1,180 | up to 1,780 | up to 1,770 | up to 7,100 | up to 7,100 |
| Sequential Write (MB/s) | up to 864 | up to 718 | up to 867 | up to 718 | up to 5,500 | up to 5,500 |
| Random 4KB Read (IOPS) | up to 140,000 | up to 140,000 | up to 89,000 | up to 140,000 | up to 500,000 | up to 500,000 |
| Random 4KB Write (IOPS) | up to 134,000 | up to 100,000 | up to 136,000 | up to 100,000 | up to 950,000 | up to 950,000 |
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