e.MMC


Eingebettete Systeme mit kleinem Formfaktor haben häufig NAND-Komponenten verwendet, die direkt mit der Host-Controller-Software verbunden und verwaltet wurden. Diese Aufgabe ist aufgrund der zunehmenden Komplexität von NAND-Geräten und deren Verwaltung zu einer Herausforderung geworden.

Managed NAND ist die Lösung: Eine einzige kleine BGA-Komponente enthält mehrere Flash-Chips, einen NAND-Controller und die Management-Firmware und vereinfacht die Integration. Die e.MMC EM-20- und EM-30-Familie von Swissbit deckt mehrere Kapazitäten und Schnittstellengeschwindigkeiten ab. Das ausgeklügelte NAND-Management macht das e.MMC ideal für Anwendungen wie POS/POI, SPS, IoT, Gaming, Medizin oder als allgemeines Boot-Medium für eingebettete Anwendungen. Das EN-20 PCIe/NVMe BGA öffnet die Tür für hohe Geschwindigkeit bei kleiner Größe.

Series Name

EM-30

EM-36

EM-20

EM-26

Compliance

JEDEC e.MMC 5.1

JEDEC e.MMC 5.0

Interface

Data Transfer Mode

e.MMC 1-bit, 4-bit, 8-bit up to HS400

Package

153-ball BGA, 0.5mm pitch
100-ball BGA, 1mm pitch

153-ball BGA, 0.5mm pitch

Max Outline Dimensions

11.5 x 13 x 1.2 mm
14.0 x 18 x 1.4 mm

11.5 x 13.0 x 1.0 mm

Flash Type

3D TLC

3D pSLC / enhanced mode

MLC

pSLC / enhanced mode

Density Range

16-256 GB

5-80 GB

4-64 GB

2-32 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance
(P/E Cycles)

3k @ TLC mode
30k @ enhanced mode

3k @ MLC mode
20k @ enhanced mode

Operating Temperature

Industrial: -40°C to +85°C
Automotive: -40°C to +105°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance
sustained

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)

 

up to 300
up to 230
up to 39,500
up to 41,500

 

up to 300
up to 230
up to 39,500
up to 41,500

 

up to 174
up to 21
up to 3,800
up to 1,400

 

up to 240
up to 120
up to 6,700
up to 6,700

Voltage

VCCQ: 1.70-1.95V / 2.70-3.60V ; VCC: 2.70-3.60

Features & Tools

High performance up to HS400 mode
Sophisticated Wear Levelling & Read Disturb Management
Command Queue Feature
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB
Detailled life time info

AEC-Q Grade 2, ISO 27001, IATF 16949

High performance up to HS400 mode
Sophisticated Wear Levelling & Read Disturb Management
Page based FTL Management
Production State Aware
Proven Power Fail Safety
Security features – secure erase & RPMB

Detailed block erase counter data via the Extended CSD Register

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).

M.2 PCIe BGA


Die EN-20 ist ein Produkt mit PCIe 3.1 / NVMe 1.3, DRAM-Support und einem Betriebsmodus mit bis zu 4 Lanes. Sie bietet sowohl eine hohe Leistung als auch eine kurze Latenz für zeitgemäße Anwendungen. Das Datenpflegemanagement mit adaptivem Read-Refresh und Medien-Scan im Hintergrund sorgt für die Stabilität der Flash-Blöcke und ermöglicht selbst bei geringer Schreibhäufigkeit eine lange Nutzungsdauer.

Bei höheren Lebensdauernaforderungen bietet sich die EN-26 mit 3D NAND pSLC Technologie an, die gegenüber der EN-20 eine 10-fach höhere Schreibmenge erlaubt.

Series Name

EN-20 EN-26

Interface

Data Transfer Mode

PCIe Gen 3.1, 4 PCIe lanes
NVMe 1.3

Package

BGA 391 ball, 0.8mm pitch

Outline Dimensions

16mm x 20mm x 1.8mm

Flash Type

3D NAND TLC

3D NAND pSLC

Density Range

15-480 GB 5-160 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance

3,000 P/E cycles per Flash block

30,000 P/E cycles per Flash block

Operating Temperature

-40°C to +85°C (up to 95°C TCase)

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS
Random 4KB Write (IOPS

 

up to 1,770
up to 720
up to 150,000
up to 100,000

 

up to 1,770
up to 720
up to 150,000
up to 100,000

MTBF

~3,000,000 hours

Voltages

3.3V ±5%, 1.8V ±5%, 0.9V ±5%

Features & Tools

HMB support
Dynamic and Static Wear Leveling
Page Mode Flash Translation Layer
Data Care Management
Write Amplification Reduction
Power Fail Data Loss Protection
In-Field Firmware Update
Self-Monitoring, Analysis, and Reporting Technology (S.M.A.R.T.)
AES256 Encryption

Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Secure erase
Secure erase (Sanitize / Purge) / Fast erase

This feature uses an uninterruptable sequence of data erase commands. Even a power off can’t stop the process, which will continue upon restoration of power. The optional enhanced feature allows the customer to sanitize the data according to different standards like DoD, NSA, IREC, etc. The purge algorithm can be started by a software command or through a hardware pin.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).