With 12 years of experience and success in the assembly of COB memory modules, Swissbit enables its customers to take advantage of COB features not found in SMT memory modules. As a result of both Swissbit’s experience and innovation potential, Swissbit’s earliest achievement within this technology was the development and production of the first 1GB MicroDIMM in the world.

As the world’s only manufacturer utilizing COB technology, Swissbit produces a robust line of memory modules that lend themselves to demanding Industrial and Embedded applications. COB technology involves mounting DRAM of Flash semiconductor die directly on a substrate without the need of a packaged component. Additionally, COB technology reduces the number of interconnects between an active die and the substrate, which improves the overall circuit speed, leads to higher clock rates, better electrical performance, and improved signal quality and increases the overall reliability of the module. A coating of an Epoxy encapsulent (or Glob Top) is applied that hermetically seals and protects the die and the wire bonded interconnections. The Glob Top also acts like a heat spreader between dies, improves heat emission, adds low coefficients of thermal expansion (CTEs), and provides a hermetically sealed module assembly. A COB memory module as offered by Swissbit provides customers with the following advantages:

• Typically Swissbit SODIMMS are 1.00” (25.4mm) high, low profile format. Typical SMT modules are 1.25” (31.75mm). This enables Swissbit’s modules to be used in more applications and allows better airflow.
• COB modules are 3.0mm thin; typical SMT modules are 3.8mm thick. A thinner design allows for better air flow and the installed module in most applications resulting in cooler operation.
• The thermal properties of Swissbit modules are superior to typical SMT modules. COB modules dissipate heat more efficiently and will run lower die junction temperatures in demanding convective cooling conditions. A cooler operating module runs faster and lasts longer.
• Our COB module has less lead frame connections then the typical SMT modules, which results in better signal integrity and higher reliability.
• Swissbit COB modules are available in commercial temperature grade (0C to +70C) and three extended temperature grades up to industrial grade (-40C to +85C).
• COB modules accept conformal coating better than typical SMT modules do due to their low profile and Glob Top encapsulation.
• Swissbit COB modules are inherently ruggedized for shock and vibration due to the COB technology and the Glob Top encapsulation process; typical SMT modules are not ruggedized.
• Swissbit COB modules are burned in and 100% tested at the module level as finish product, not at the IC level before assembly.
• All Swissbit COB modules are RoHS compliant.