M.2 SATA


Ebenso wie die 2,5-Zoll-Laufwerke zielen die Swissbit mSATA (MO-300), SLIM SATA (MO-297) und die M.2-SSDs auf eingebettete Anwendungen ab, die Solid-State-Speicher in kleinen, austauschbaren Formfaktoren erfordern. Die SSD-Module sind dafür ausgelegt Robustheit gegenüber häufigen Temperaturwechseln im Bereich von -40 °C bis 85 °C, halten starken Stößen und Vibrationen stand und bieten überlegene Leistung und Langlebigkeit.

Die Familien X-86, X-75, X-76, X-60, X-66 und X-600 zielen auf verschiedene Anwendungsfälle ab, darunter Betriebssystemstart, Datenprotokollierung, Überwachungsaufzeichnung oder Vaulting. Der X-78m2 zielt zusätzlich auf leichte Unternehmensanwendungen ab. Die Menge und Art der Schreibzugriffe definiert die erforderliche Ausdauer in TBW. Die neueste Ergänzung X-86m2 zielt auf echte Industrieanwendungen mit einem robusten, zuverlässigen Moduldesign mit geringem Stromverbrauch ab, das auf einem dedizierten Industriecontroller und Firmware basiert.

Series Name X-66m2 X-600m2 X-76m2 / X-78m2 X-75m2
X-86m2
Interface
Data Transfer Mode
SATA III – 6 Gbit/s
ATA8
Connector 75 pos. Edge Connector
B & M key
Outline Dimensions 22 x 42 x 3.6 mm
Flash Type

pSLC everbit

SLC 3D NAND pSLC 3D NAND TLC 3D NAND pSLC
Density Range

X-66m2: 16-120 GB

8-64 GB

X-76m2: 10-160 GB
X-78m2: 40-320 GB

30-960 GB

10-160 GB

Data Retention 10 years @ life begin
1 year @ life end
Endurance [DWPD]
JESD219 Client Endurance Workload
13.2 36.3 max 22.7 / max 60.5 max 1.2 max 13.3
Operating Temperature Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature -40°C to +85°C
Performance
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
 
up to 520
up to 340
up to 72k
up to 78k
 
up to 520
up to 245
up to 76k
up to 54k
 
up to 560 / 560
up to 480 / 490
up to 72.9k / 72.9k
up to 84.9k / 85.9k

 
up to 565
up to 495
up to 76k
up to 79.4k

 
up to 370
up to 225
up to 13.1k
up to 8.3k

Voltage 3.3 V ± 5 %
Features & Tools

FW based Power Fail Safety
AES 256 Encryption (optional)
SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Path Protection
AES 256 Encryption (optional) / TCG OPAL 2.0 (optional)
FW based Power Fail Safety
SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring
Series Name X-60m2 / X-66m2 X-600m2 X-76m2 / X-78m2
X-75m2 / X-75m2 P
Interface
Data Transfer Mode
SATA III – 6 Gbit/s
ATA8
Connector 75 pos. Edge Connector
B & M key
Outline Dimensions 22 x 80 x 3.58 mm
22 x 60 mm X-60m2
22 x 80 x 3.58 mm
Flash Type

MLC durabit
pSLC everbit

SLC 3D NAND pSLC 3D NAND TLC
Density Range

X-60m2: 30-960 GB
X-66m2: 16-480 GB

16-128 GB

X-76m2: 10-320 GB
X-78m2: 32-320 GB

X-75m2:      30-1,920GB
X-75m2 P: 240-1,920GB

Data Retention 10 years @ life begin
1 year @ life end
Endurance [DWPD]
JESD219 Client Endurance Workload
13.2 / 2.0 36.3 max 22.7 / 60 max 1.2
Operating Temperature Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
Storage Temperature -40°C to +85°C
Performance
Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)
 
up to 520 / 520
up to 460 / 450
up to 75k / 80k
up to 75k / 75k
 
up to 520
up to 405
up to 76k
up to 73k
 
up to 560 / 560
up to 480 / 480
up to 72.9k / 70.4k
up to 84.9k / 85.9k

 
up to 565 / 560
up to 495 / 500
up to 77.2k / 77.7k
up to 79.4k / 73.3k

Voltage 3.3 V ± 5 %
Features & Tools

FW based Power Fail Safety
AES 256 Encryption (optional)
SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Path Protection
AES 256 Encryption (optional) / TCG OPAL 2.0 (optional)
FW based Power Fail Safety
X-75m2 P: HW powersafe™ protection
SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

mSATA MO-300


Die mSATA-SSD-Module MO-300 (volle Größe) von Swissbit sind ideale Lösungen für eingebettete Anwendungen, die Solid-State-Speicher mit kleinem, auswechselbarem Formfaktor erfordern. Jedes Gerät wird im gesamten Temperaturbereich umfassend getestet, bevor es für den Versand freigegeben wird.
Das X-66m mit pSLC/X-60m mit MLC und das X-600m mit SLC unterstützen SATA-Schnittstellen mit 6 GBit/s Geschwindigkeit und DRAM-unterstütztem FTL. Sie sind für alle industriellen, NetCom- und Automobilanwendungen ausgelegt, die hohe Datenübertragungsraten von bis zu 520 MBit/s bei sequentiellem Zugriff und 78.000 IOPS beim Zugriff auf verteilte Daten (4 KB) erfordern.

Die neuen X-75m mSATA-Module mit industrietauglichem 3D-NAND wurden für anspruchsvolle Anwendungen entwickelt und unterstützen Datenaktualisierung im Hintergrund sowie AES- und End-to-End-Datensicherung.
Bei höheren Anforderungen in Bezug auf Endurance ist die X-76m mit 3D pSLC Mode die ideale Lösung.

Series Name

X-60m / X-66m

X-600m

X-75m / X-76m

Interface
Data Transfer Mode

SATA Gen3 – 6 Gbit/s
ATA8

Connector

52 pos. Edge Connector (PCI Express mini)

Outline Dimensions

50.8 x 29.85 x 3.8 mm

Flash Type

MLC durabit
pSLC everbit

SLC

3D NAND TLC / pSLC

Density Range

X-60m: 30–480 GB
X-66m: 16-240 GB

8-128 GB

X-75m: 30-960 GB
X-76m: 10-320 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]
JESD219 Client Endurance Workload

2.0 / 13.2 33.8

max 1.2 / max 22.7

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)

 

up to 520 / 520
up to 450 / 450
up to 75,000 / 80,000
up to 75,000 / 75,000

 

up to 520
up to 405
up to 76,000
up to 73,000

 

up to 565 / 560
up to 495 / 480
up to 73,600 / 74,000
up to 79,400 / 84,900

Voltage

3.3 V ± 5 %

Features & Tools

FW based Power Fail Safety
AES 256 Encryption (optional)
SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Path Protection
AES 256 Encryption (optional)
TCG OPAL 2.0 (optional)
FW based Power Fail Safety
SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring

SLIM SATA MO-297


Die SATA-SSD-Module MO-297 von Swissbit sind ideale Lösungen für eingebettete Anwendungen, die Solid-State-Speicher mit kleinem, auswechselbarem Formfaktor erfordern. Jedes Gerät wird im gesamten Temperaturbereich umfassend getestet, bevor es für den Versand freigegeben wird. Die Produktreihe X-60s / X-600s (MLC / SLC) wurde für alle Industrie-, NetCom- und Automobilanwendungen ausgelegt, die hohe Datenübertragungsraten von bis zu 525 MBit/s bei sequentiellem Zugriff und 79.000 IOPS beim Zugriff auf verteilte Daten (4 KB) erfordern.

Die neuen X-75s-Module mit industrietauglichem 3D-NAND wurden für anspruchsvolle Anwendungen entwickelt und unterstützen Datenaktualisierung im Hintergrund sowie AES-256- und End-to-End-Datensicherung. Bei höheren Anforderungen in Bezug auf Endurance ist die X-76m mit 3D pSLC Mode die ideale Lösung.

Series Name

X-60s

X-600s

X-75s / X-76s

X-78s

Interface
Data Transfer Mode

SATA Gen3 – 6 Gbit/s
ATA8

Connector

15 + 7 pin Serial ATA Connector

Outline Dimensions

54 x 39 x 4.0 mm

Flash Type

MLC durabit

SLC

3D NAND TLC / pSLC

3D NAND pSLC

Density Range

30–480 GB

8-128 GB

X-75s: 30-960 GB
X-76s: 10-320 GB

32-320 GB

Data Retention

10 years @ life begin
1 year @ life end

Endurance [DWPD]
JESD219 Client Endurance Workload

2.0 36.32

max 1.2 / max 22.7

max 48.8

Operating Temperature

Commercial: 0°C to +70°C
Industrial: -40°C to +85°C

Industrial: -40°C to +85°C

Storage Temperature

-40°C to +85°C

Performance

Sequential Read (MB/s)
Sequential Write (MB/s)
Random 4KB Read (IOPS)
Random 4KB Write (IOPS)

 

up to 520
up to 450
up to 75,000
up to 75,000

 

up to 520
up to 405
up to 76,000
up to 73,000

 

up to 565 / 560
up to 495 / 480
up to 73,600 / 74,000
up to 79,400 / 84,900

 

up to 560
up to 490
up to 70,500
up to 85,900

Voltage

3.3 V ± 5 %

Features & Tools

FW based Power Fail Safety
AES 256 Encryption (optional)
SBDM Tool & SDK for S.M.A.R.T. based Life Time Monitoring

E2E Data Path Protection
AES 256 Encryption (optional)
TCG OPAL 2.0 (optional)
FW based Power Fail Safety
SBDM Tool & SDK for detailed S.M.A.R.T. based Life Time Monitoring
Data care management
Data Care Management

Various effects like data retention, read disturb limits, or temperature can impact data reliability. The latest generation of Swissbit products use special methods to maintain and refresh the data for higher data integrity.

Electrostatic discharge and electromagnetic interference
ESD and EMI safe

The product designs are in line with the latest regulations for electrostatic discharge and electromagnetic interference. Swissbit strives to exceed these limits with our own in-house technology and production capabilities, for example with System-in-Package (SiP) competence.

Life Time Monitoring (LTM)
Life time monitoring (LTM)

The Swissbit Life Time Monitoring feature enables users to access the memory device’s detailed Life Time Status and allows prediction of imminent failure, avoiding unexpected data loss. This feature uses an extended S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) interface or vendor-specific commands to retrieve the Flash product information.

Longevity
Longevity

The longevity product lines use special components with a long-term supply commitment of up to 10 years. These products offer lowest TCO in demanding applications with high requalification cost.

Power Fail Protection & Recovery
Power fail protection

Intelligent Power Fail Protection and Recovery protects data from unexpected power loss. During an unintentional shutdown, firmware routines and an intelligent hardware architecture ensure that all system and user data will be stored to the NAND.

Power fail protection PLUS

Products with the Swissbit powersafe feature use reliable tantalum capacitors to store energy so that in case of a sudden power fail the charge will be used to harden the cache content into the NAND flash.

Shock & Vibration
Shock and vibration

Robustness is one of our key specification targets. The design, assembly and use of selected materials guarantee an extremely solid design which has been validated by extensive testing.

Temperature sensor
Temperature sensor

The sensor allows the host hardware or software to monitor the memory device temperature to improve data reliability in the target application environment.

TRIM support
Trim support

The TRIM command allows the operating system to inform the SSD which blocks of data are no longer considered in use and can be wiped out internally, which increases system performance in following write accesses. With TRIM Support data scrap can be deleted in advance, which otherwise would slow down future write operations to the involved blocks.

Write Amplification Factor
WAF reduction

The WAF (write amplification factor) for MLC-based products is reduced by combining a paged based FW block management with a powerful card architecture and configuration settings.

Wear leveling
Wear leveling

Sophisticated Wear Leveling and Bad Block Management ensure that Flash cells are sparingly and equally used in order to prolong life time of the device.

Wide temperature support
Wide temperature support

Swissbit‘s embedded memory and storage solutions are designed and approved for reliable operation over a wide temperature range. The products are verified at temperature corners and prestressed with a burn-in operating functional test (Test During Burn In – TDBI).